Like-layers resolution deficiency in structure function-based thermal test for multilayer semiconductor device and its potential cure by interface design
Multilayer thermal test has long been a challenge for many applications. In this work, we focus on the challenge it poses to the 3D architected semiconductor devices or integrated circuits (ICs). Structure function method (SFM) as an important commercialized measurement method for layered analysis o...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-12-01
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| Series: | Results in Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2590123024018346 |
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