Microstructures, mechanical properties and reliability induced from size effect in Sn-based solder joints: Review
With the continuous advancement of integrated packaging technology, the dimensions of Sn-based interconnected joints are being steadily reduced. It is necessary to investigate the dependability of Sn-based solder joints with various size since the change in size influences the mechanical and microst...
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| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-03-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425004168 |
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