Design of a Novel SiP Integrated RF Front-End Module Based on SOI Switch and SAW Filter

Design of a Novel SiP Integrated RF Front-End Module Based on SOI Switch and SAW Filter

This paper proposes a novel System-in-Package (SiP) integrated architecture that incorporates Silicon-On-Insulator (SOI) switches and Surface Acoustic Wave (SAW) filters within the chip, aiming to fulfill the demands for miniaturization and multi-functionality for application in emerging wireless te...

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Bibliographic Details
Main Authors:	Xuanhe Wei, Youming Miao, Xiao Jin, Tian Hong Loh, Gui Liu
Format:	Article
Language:	English
Published:	MDPI AG 2024-10-01
Series:	Sensors
Subjects:	SiP integration CA diversity acceptance RF front-end module
Online Access:	https://www.mdpi.com/1424-8220/24/21/6994
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