Double Sided Lapping/Polishing Machine Grinding Trajectory Studies

In this paper,by analyzing the double-sided lapping /polishing processing mechanism,the stress analysis was carried out on the workpiece,and we establish the pads relatively workpiece in machining the movement principle of trajectory model,pads,relative to the workpiece trajectory simulation analysi...

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Bibliographic Details
Main Authors: XU Li, LIU Bing, WU Shi, DUAN Hao-yang, DONG Rui
Format: Article
Language:zho
Published: Harbin University of Science and Technology Publications 2018-08-01
Series:Journal of Harbin University of Science and Technology
Subjects:
Online Access:https://hlgxb.hrbust.edu.cn/#/digest?ArticleID=1553
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