Fluid drawing printing 3D conductive structures for flexible circuit manufacturing

Fluid drawing printing 3D conductive structures for flexible circuit manufacturing

Abstract Three-dimensional (3D) conductive structures significantly reduce flexible circuit complexity and enhance circuit integration. Direct extrusion printing technology offers the advantages of various material applicability and high flexibility for fabricating filamentary interconnects. The pri...

Full description

Saved in:
Bibliographic Details
Main Authors: Yikang Li, Dazhi Wang, Yiwen Feng, Xiangji Chen, Xu Chen, Chang Liu, Yanteng Li, Liujia Suo, Ran Zhang, Xiaopeng Zhang, Ben Liu, Fengshu Wang, Shiwen Liang, Lingjie Kong, Qiang Fu, Tongqun Ren, Tiesheng Wang
Format: Article
Language:English
Published: Nature Publishing Group 2025-05-01
Series:Microsystems & Nanoengineering
Online Access:https://doi.org/10.1038/s41378-025-00936-0
Tags: Add Tag
No Tags, Be the first to tag this record!

Internet

https://doi.org/10.1038/s41378-025-00936-0

Similar Items