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  1. 141

    Fabrication of Electrospun Porous TiO<sub>2</sub> Dielectric Film in a Ti–TiO<sub>2</sub>–Si Heterostructure for Metal–Insulator–Semiconductor Capacitors by Jin-Uk Yoo, Tae-Min Choi, Sung-Gyu Pyo

    Published 2024-09-01
    “…Further studies will show that it is flexible and dielectric tunable, thus contributing to improve the performance of next-generation electronic devices.…”
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    Article
  2. 142
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  4. 144

    Tough, self-healing and weldable hydrogel via thermal engineering optimized multi-scale structures by Sirawit Pruksawan, Jun En Terence Loh, Kenny Hao Zheng Chong, Zhan Au Chua, Yi Ting Chong, Zi Yang Chia, Khye Soon Andy Yew, FuKe Wang

    Published 2025-05-01
    “…Bioinspired strategies to engineer molecular- and microscale-level hierarchical structures have shown promise in the development of tough hydrogels but often involve complex, time- and energy-intensive processes. …”
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    Article
  5. 145

    Simulation of flow dynamics and heat transfer behavior of nanofluid in microchannel with rough surfaces by Ali Kashani, Rassol Hamed Rasheed, Muntadher Abed Hussein, Omid Ali Akbari, Hadeel Kareem Abdul-Redha, Gholamreza Ahmadi, Soheil Salahshour, Rozbeh Sabetvand

    Published 2024-11-01
    “…Microchannels containing cooling fluid are among the most widely used equipment in the cooling of microscale devices, such as heat sinks in the electronics industry. …”
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    Article
  6. 146

    Radiative Heat Transfer Properties of Fiber–Aerogel Composites for Thermal Insulation by Mohanapriya Venkataraman, Sebnem Sözcü, Jiří Militký

    Published 2025-07-01
    “…Their brittle skeleton and high infrared transparency, however, restrict how well they insulate, particularly at high temperatures (>300 °C). Incorporating microscale fibers into the aerogel matrix enhances mechanical strength and reduces radiative heat transfer by increasing scattering and absorption. …”
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    Near-Field Direct Writing Based on Piezoelectric Micromotion for the Programmable Manufacturing of Serpentine Structures by Xun Chen, Xuanzhi Zhang, Jianfeng Sun, Rongguang Zhang, Xuanyang Liang, Jiecai Long, Jingsong Yao, Xin Chen, Han Wang, Yu Zhang, Jiewu Leng, Renquan Lu

    Published 2024-12-01
    “…Serpentine microstructures offer excellent physical properties, making them highly promising in applications in stretchable electronics and tissue engineering. However, existing fabrication methods, such as electrospinning and lithography, face significant challenges in producing microscale serpentine structures that are cost-effective, efficient, and controllable. …”
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    Article
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  12. 152

    Micro-spring force sensors using conductive photosensitive resin fabricated via two-photon polymerization by Ningning Hu, Yucheng Deng, Lujia Ding, Lijun Men, Wenjun Zhang, Ruixue Yin

    Published 2025-08-01
    “…The development of flexible, high-performance microscale force sensors remains a critical challenge for next-generation biomedical and wearable electronics. …”
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    Article
  13. 153

    Smart gloves with strain/pressure dual-mode tactile sensor for UAV flight control by Zikai Yang, Qihao Zhang, Qin Luo, Jianhao Shen, Can Yang, Dai Li, Xiaohong Yin, Xiaohua Liu

    Published 2025-06-01
    “…The proposed polyurethane (TPU)/multi-walled carbon nanotube (MWCNT) electronic skin, termed TMES, features a flexible, biomimetic polydimethylsiloxane (PDMS) microcones interlocked with a microscale cracked TPU/MWCNT conductive network, exhibiting exceptional sensitivity in its positive resistance response to strain (630 at 70 %) and negative resistance response to pressure (−0.14004 kPa−1 in the 0–2.5 kPa range), as well as long-term stable working performance (>10,000 cycles). …”
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  14. 154
  15. 155

    The state-of-the-art fundamentals and applications of micro-energy systems on-chip by Xu Jianxin, Ma Shaohua, Gao Peng, Guo Yonggang, Sun Jianfeng, Qiao Dayong, Ma Binghe, Yuan Weizheng, Ramakrishna Seeram, Ye Tao

    Published 2024-10-01
    “…In this work, we discuss new opportunities for MESOC, including newly investigated microscale energy harvesting devices, advanced energy storage devices, high-efficiency management modules, and system integration. …”
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    Article
  16. 156

    The current induced mass transformation of Ag alloy wire bonded led chip by Xiaohong Yuan, Qinlian He, Shanju Zheng, Jiaheng Zhang, Dapeng Yang, Qinsong Bi, Yuxi Luo, Dengquan Chen, Xiaojing Wang

    Published 2025-03-01
    “…This study supplements and enhances the research framework of Ag/Al interface IMC at bonding joints, contributing to further development of reliable electronic packaging devices.…”
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    Article
  17. 157