Artificial neural network based delamination prediction in composite plates using vibration signals by T. G. Sreekanth, M. Senthilkumar, S. Manikanta Reddy

“…The findings show that the suggested technique can satisfactorily estimate the location and extent of delaminations in composite plates.…”
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Reliability of Substrate Solder Joints from Power Cycling Tests by Thomas Hunger, 德国

“…The lifetime of the solder joint between base plate and ceramic substrate is usually tested by passively heating and cooling the IGBT module (thermal cycling). …”
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