Visual Perception of Organic and Polygonal Shapes in the Graphic Communication Processes by Robert Geček, Damir Vusić

“…Many factors influence the visibility and proper reception of visual messages. …”
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Automatic Task Planning and Its On-Orbit Verification of Agile Remote Sensing Satellite by Zhang Yahang, Yang Haiyue, Yang Mengfei, Yang Ruochu, Leng Shuhang

“…No more than 128 ordered points describe the curve area task or irregular polygon area task, and the complex task is decomposed into several strips according to the satellite imaging width. …”
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Seed Morphometry of Native Indonesian Orchids in the Genus Dendrobium by Sucipto Hariyanto, Intan Ayu Pratiwi, Edy Setiti Wida Utami

“…Additionally, the clear variation in the testa ornamentation pattern includes the species of D. leporinum, where the testa cells were in the medial regular rectangles, but in the apical and basal pole they are polygonal and irregularly oriented; the testa cells of D. antennatum are polygonal and irregularly oriented and those of D. purpureum are longitudinally oriented with regular rectangles.…”
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Antioxidant and anti-diabetic potential of the green synthesized silver nanoparticles using Martynia annua L. root extract by Megha B. Abbigeri, Bothe Thokchom, Sapam Riches Singh, Santosh Mallikarjun Bhavi, B.P. Harini, Ramesh Babu Yarajarla

“…Characterization through UV-Visible spectroscopy, FTIR, DLS, and SEM/EDX confirmed the formation of AgNPs with polygonal morphology and an average size of 64 nm, with the PDI of 0.385. …”
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Effect of Additives on Electrodeposition of Copper in Ch Cl-Gl A Low Eutectic Solvent by LIU Yang, HAO Jianjun, YIN Hongkun, WANG Xinhui

“…The use of additives facilitates the deposition of copper on metal substrates.In this work，using choline chloride glacial acetic acid(Ch Cl-Gl A) as a low eutectic solvent and copper acetate as the main salt， the effects of ascorbic acid(C6H8O6)， disodium ethylenediamine tetraacetic acid(EDTA-2Na) and diethylenetriaminepentaacetic acid(DTPA) as additives on electrodeposition of copper on iron substrate were investigated.Electrochemical behavior was studied by cyclic voltammetry (CV) and chronoamperometry (CA)； scanning electron microscopy(SEM) and X-ray diffraction(XRD) were used to observe and analyze the morphology and composition of the coating.The UV-visible absorption spectrum of the complex formed in the electrodeposited solution with different additives was analyzed by a UV-Vis-NIR spectrophotometer.Results indicated that in Ch Cl-Gl A， the electrodeposition of copper involved two steps of oxidation-reduction with the first step of Cu2＋→Cu＋and the second step of Cu＋→Cu.All three additives promoted the deposition of copper in Ch Cl-Gl A，and ascorbic acid had the best effect，which could obtain a copper coating with good performance at room temperature.The electrodeposition of copper in Ch Cl-Gl A followed a three-dimensional instantaneous nucleation process and was an irreversible reaction controlled by diffusion.Moreover，the diffusion coefficients of Cu2＋and Cu＋could reach 4.003 9×10－7 cm2/s，4.762 7×10－7 cm2/s，respectively.The copper crystal prepared with ascorbic acid as additive was a polygonal sheet-like structure with distinct grains，and the optimal crystal plane was the (111) crystal plane.Besides，the average grain sizes of the copper layer with additives DTPA，EDTA-2Na and C6H8O6 were 50.71，55.12 and 52.73 nm.The average grain size of the copper layer without additive was 44.73 nm.…”
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