Thermodynamic analysis and characterization of alloys in Bi-Cu-Sb system by Živković D., Minić D., Manasijević D., Kostov A., Talijan N., Balanović Lj., Mitovski A., Živković Ž.

Subjects: “…kead-free solder materials…”
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Development of heat resistant Pb-free joints by TLPS process of Ag and Sn-Bi-Ag alloy powders by Ohnuma I., Kainuma R., Ishida K.

Subjects: “…high-tepmerature Pb-free solder…”
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Numerical analysis and thermal fatigue life prediction of solder layer in a SiC-IGBT power module by Dianhao Zhang, Xiao-guang Huang, Bin-liang Cheng, Neng Zhang

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Effect of Additive Elements Bi/Ni/Ge on Crack Initiation and Propagation for Low-Ag Solders by Noritake Hiyoshi, Mitsuo Yamashita, Hiroaki Hokazono

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Effect of additive elements Bi/Ni/Ge on crack initiation and propagation for low-Ag solders by Noritake Hiyoshi, Mitsuo Yamashita, Hiroaki Hokazono

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Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation by Yuezong Zheng, Junchen Liu, Hongchao Ji, Xiaomin Huang, Wenchao Xiao, Abdullah Aziz Saad

Subjects: “…Lead-free solder…”
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RESEARCH ON THERMAL FATIGUE LIFE OF SOLDER JOINTS FOR AIRBORNE ELECTRONIC EQUIPMENT by CU QiangYi, LIU ZhiHu, TIAN Feng, ZHANG FengHua, ZHAO Gang, WU Bo

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Intermetallic compound layer and fatigue crack evolution of Bi-contained Sn-1.0Ag-0.5Cu solder under thermal aging and thermal fatigue by Junjie Zhao, Jun Wu, Jiayu Zhang, Mingqin Liao, Fengjiang Wang

Subjects: “…Sn-Ag-Cu solder…”
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THERMAL STRESS ANALYSIS OF OPTICAL FIBER IN FLEXIBLE PTOELECTRONIC INTERCONNECTION PRINTED CIRCUIT BOARD BASED ON FINITE ELEMENT METHOD by WANG WeiYin, WU ZhaoHua, CHEN GuDi, WANG ZhiQi, CHEN XiaoYong

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ESTIMATION OF THERMAL PARAMETERS OF POWER BIPOLAR TRANSISTORS BY THE METHOD OF THERMAL RELAXATION DIFFERENTIAL SPECTROMETRY by V. S. Niss, A. S. Vaskou, A. S. Turtsevich, A. F. Kerentsev, V. K. Kononenko

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Investigation of temperature homogeneity during infrared soldering of silicon solar cells using the finite element method by Joseph Daniel Christopher, De Rose Angela, Eberlein Dirk, Parlayan Onur, Grübel Benjamin, Beinert Andreas J., Neuhaus Holger

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Design of Ag-Ge-Zn braze/solder alloys: Experimental thermodynamics and surface properties by Delsante S., Li D., Novakovic R., Borzone G.

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STUDY ON CHIP COMPONENT NO-FILLET SOLDER JOINT STRESS AND STRAIN UNDER THERMAL CYCLE by LIN XunChao, LIANG Ying

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FINITE ELEMENT STRESS AND STRAIN ANALYSIS OF BGA SOLDER JOINT OF BOARD LEVEL OPTICAL INTERCONNECTION MODULE UNDER TEMPERATURE AND VIBRATION COUPLED CONDITION by HUA JianWei, HUANG ChunYue, LIANG Ying, HUANG Wei, ZHANG Long

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Efficient Modeling Framework for FO-WLP Solder Interconnect Behavior During Thermal Cycling by Ramiro Sebastian Vargas Cruz, Viktor Gonda

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Influence of Aging Processes on the Characteristics of Power LEDs Soldered Using Composite Solder Pastes by Krzysztof Górecki, Przemysław Ptak, Agata Skwarek

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STUDY ON ELECTRONIC PACKAGE MINIATURE BALL GRID ARRAY SOLDER JOINTS STRESS AND STRAIN UNDER THREE POINT BENDING by LIANG Ying, HUANG ChunYue, YIN Rui, HUANG Wei, LI TianMing, ZHAO HongWang

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Study on the Electromigration Organization and Mechanical Properties of Sn2.5Ag0.7Cu0.1RE/Cu Solder Joints by Yuming Wang, Keke Zhang, Chao Zhang, Fupeng Huo, Yijie Gao

Subjects: “…Sn2.5Ag0.7Cu0.1RE soldering metal…”
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