Energy-/Carbon-Aware Evaluation and Optimization of 3-D IC Architecture With Digital Compute-in-Memory Designs by Hyung Joon Byun, Udit Gupta, Jae-Sun Seo

Subjects: “…3-D integrated circuit (IC)…”
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A Design of Fault-Tolerant Battery Monitoring IC for Electric Vehicles Complying With ISO 26262 by Byambajav Ragchaa, Liji Wu, Xiangmin Zhang

Subjects: “…battery monitoring integrated circuit…”
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A radix‐8 modulo 2n multiplier using area and power‐optimized hard multiple generator by Naveen Kr. Kabra, Zuber M. Patel

Subjects: “…integrated circuit layout…”
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Recycled integrated circuit detection using reliability analysis and machine learning algorithms by Udaya Shankar Santhana Krishnan, Kalpana Palanisamy

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Verification of serialising instructions for security against transient execution attacks by Kushal K. Ponugoti, Sudarshan K. Srinivasan, Nimish Mathure

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Memristor‐transistor hybrid ternary content addressable memory using ternary memristive memory cell by Masoodur Rahman Khan, ABM Harun‐ur Rashid

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Noise‐based logic locking scheme against signal probability skew analysis by Ahmad Rezaei, Ali Mahani

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Ferroelectric memory: state-of-the-art manufacturing and research by D. A. Abdullaev, R. A. Milovanov, R. L. Volkov, N. I. Borgardt, A. N. Lantsev, K. A. Vorotilov, A. S. Sigov

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TVD‐PB logic circuit based on camouflaging circuit for IoT security by Yuejun Zhang, Qiufeng Wu, Pengjun Wang, Liang Wen, Zhicun Luan, Chongyan Gu

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New scan compression approach to reduce the test data volume by Pralhadrao V. Shantagiri, Rohit Kapur, Chandrasekar Shastry

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All‐digital built‐in self‐test scheme for charge‐pump phase‐locked loops by Lanhua Xia, Jifei Tang

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Design of 10T SRAM cell with improved read performance and expanded write margin by Ashish Sachdeva, V. K. Tomar

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On estimation of maximal value of full diffusion time of infused and implanted dopants by E. L. Pankratov

Subjects: “…Manufacturing of integrated circuit elements…”
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Evaluation of a Plasmon-Based Optical Integrated Circuit for Error-Tolerant Streaming Applications by Samantha Lubaba Noor, Xuan Wu, Dennis Lin, Pol van Dorpe, Francky Catthoor, Patrick Reynaert, Azad Naeemi

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Toward Fine-Grained Partitioning of Low-Level SRAM Caches for Emerging 3D-IC Designs by Sudipta Das, Bhawana Kumari, Siva Satyendra Sahoo, Yukai Chen, James Myers, Dragomir Milojevic, Dwaipayan Biswas, Julien Ryckaert

Subjects: “…3-D integrated circuit (3D-IC)…”
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