Combined lock-in thermography and heat flow measurements for analysing heat dissipation during fatigue crack propagation by J. Bär, A. Vshivkov, O. Plekhov

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A study of the stored energy in titanium under deformation and failure using infrared data by A.Yu. Fedorova, M.V. Bannikov, O.A. Plekhov

Subjects: “…Heat dissipation…”
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Design and Optimization of the Heatsink of a Level 1 Electric Vehicle Charger by Iheanyi Emmanuel Ebere, Ashraf Ali Khan, Samuel Ogundahunsi, Emeka Ugwuemeaju, Usman Ali Khan, Shehab Ahmed

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Analysis of Copper Sleeve Magnetic Coupling Operation Characteristic and Design of Heat Dissipation Structure by Ge Yanjun, Zhang Jun, Jiang Hao, Wang Xue, Wan Zongwei

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Study on Heat Dissipation of Reduction Gearbox of a Hoisting Mechanism in Stopped State by Gao Chunhui, Hu Xiong

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A numerical investigation of heat transfer performance in a prismatic battery cooling system using hybrid nanofluids by B. Venkateswarlu, Santosh Chavan, Sang Woo Joo, Sung Chul Kim, Kottakkaran Sooppy Nisar

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Achieving Ultra‐High Heat Flux Transfer in Graphene Films via Tunable Gas Escape Channels by Haolong Zheng, Peng He, Shujing Yang, Yonghua Lu, Na Guo, Yanhong Li, Gang Wang, Guqiao Ding

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Heat dissipation and fatigue crack kinetic features of titanium alloy Grade 2 after laser shock peening by Anastasia Iziumova, Aleksei Vshivkov, Aleksandr Prokhorov, Elena Gachegova, Denis Davydov

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Heat dissipation and fatigue crack kinetic features of titanium alloy Grade 2 after laser shock peening by Anastasia Iziumova, Aleksei Vshivkov, Aleksandr Prokhorov, Elena Gachegova, Denis Davydov

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RESEARCH ON HEAT DISSIPATION OF LTCC SUBSTRATE MICROCHANNEL BASED ON ORTHOGONAL DESIGN by HE Wei, HUANG ChunYue, LIANG Ying

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ANALYSIS OF THERMAL PROPERTIES OF THE LED-LINES BY METHOD OF ELECTRICАL TRANSIENT PROCESSES by S. A. Manеgo, Yu. A. Bumai, I. A. Khorunzhii, Yu. V. Trofimov

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AgIn2 thickness on void rate, microstructure, IMC growth, thermal and mechanical properties of fluxless In@AgIn2 joint by Jing Wen, Guoliao Sun, Jinyang Su, Yi Fan, Linzheng Fu, Zhuo Chen, Wenhui Zhu

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A tree-shaped high thermal conductivity channel in a stacked chip with minimizing maximum temperature difference and entropy generation rate by Xuetao Xi, Huijun Feng, Lingen Chen, Yanlin Ge

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Conjugate heat dissipation characteristics of concurrent flow of pure water/water-based nano-emulsion through a mini- and micro-channel stacked double-layer heat sink by C.J. Ho, Jr-Wei Liao, Bo-Lin Chen, Saman Rashidi, Wei-Mon Yan

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