Showing 1 - 1 results of 1 for search '"device–package–heatsink–board level"', query time: 0.11s Refine Results
  1. 1
    A Cross-Scale Electrothermal Co-Simulation Approach for Power MOSFETs at Device–Package–Heatsink–Board Levels

    A Cross-Scale Electrothermal Co-Simulation Approach for Power MOSFETs at Device–Package–Heatsink–Board Levels by Yuxuan Dai, Jiafei Yao, Jing Chen, Qingyou Qian, Maolin Zhang, Jun Zhang, Qing Yao, Chenyang Huang, Mingshun Sun, Yufeng Guo

    Published 2024-10-01
    Subjects:
    Get full text
    Article
    Save to List
    Saved in:

Search Tools: