Showing 301 - 320 results of 326 for search '"Microelectronics"', query time: 0.04s Refine Results
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    A comparative study between E‐neurons mathematical model and circuit model by M. Daliri, Pietro M. Ferreira, G. Klisnick, A. Benlarbi‐Delai

    Published 2021-03-01
    “…This comparative study of the circuit model and a neuron mathematical model provides a quantitative understanding of the challenges between mathematical models and microelectronic circuit design criteria.…”
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    Article
  5. 305

    An Investigation into Soft Error Detection Efficiency at Operating System Level by Seyyed Amir Asghari, Okyay Kaynak, Hassan Taheri

    Published 2014-01-01
    “…The most important of these is radiation that gives rise to permanent and transient errors on microelectronic components. The occurrence rate of transient errors is significantly more than permanent errors. …”
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    Article
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    IMU Optimal Rotation Rates by Patrick Grates

    Published 2024-01-01
    “…In the field of sensors and instrumentation used for navigation, rotation of the instruments and sensors has been used extensively in navigation systems to remove errors due to bias, bias instability, and noise. Microelectronic mechanical systems (MEMSs)-based inertial measurement units (IMUs) have been rotated at increasingly higher angular rates in the interest of managing and removing error from the system. …”
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    Article
  8. 308

    Processing and Performance of Polymeric Transparent Conductive Composites by Parul Jain, Ranjani Muralidharan, Jennifer Sedloff, Xiao Li, Norma A. Alcantar, Julie P. Harmon

    Published 2013-01-01
    “…Recent advances in microelectronic and optoelectronic industries have spurred interest in the development of reticulate doped polymer films containing “metallic” charge transfer complexes. …”
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    Efficient Modeling Framework for FO-WLP Solder Interconnect Behavior During Thermal Cycling by Ramiro Sebastian Vargas Cruz, Viktor Gonda

    Published 2024-12-01
    “…In advanced microelectronic packaging, high thermo-mechanical loads arise on the solder interconnects. …”
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    Article
  11. 311

    Investigating Impacts of Local Pressure and Temperature on CVD Growth of Hexagonal Boron Nitride on Ge(001)/Si by Max Franck, Jarek Dabrowski, Markus Andreas Schubert, Dominique Vignaud, Mohamed Achehboune, Jean‐François Colomer, Luc Henrard, Christian Wenger, Mindaugas Lukosius

    Published 2025-01-01
    “…Abstract The chemical vapor deposition (CVD) growth of hexagonal boron nitride (hBN) on Ge substrates is a promising pathway to high‐quality hBN thin films without metal contaminations for microelectronic applications, but the effect of CVD process parameters on the hBN properties is not well understood yet. …”
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    Article
  12. 312

    High-performance 2D electronic devices enabled by strong and tough two-dimensional polymer with ultra-low dielectric constant by Qiyi Fang, Kongyang Yi, Tianshu Zhai, Shisong Luo, Chen-yang Lin, Qing Ai, Yifan Zhu, Boyu Zhang, Gustavo A. Alvarez, Yanjie Shao, Haolei Zhou, Guanhui Gao, Yifeng Liu, Rui Xu, Xiang Zhang, Yuzhe Wang, Xiaoyin Tian, Honghu Zhang, Yimo Han, Hanyu Zhu, Yuji Zhao, Zhiting Tian, Yu Zhong, Zheng Liu, Jun Lou

    Published 2024-12-01
    “…Abstract As the feature size of microelectronic circuits is scaling down to nanometer order, the increasing interconnect crosstalk, resistance-capacitance (RC) delay and power consumption can limit the chip performance and reliability. …”
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  13. 313

    Computational analysis of thermo-solutal Marangoni convective unsteady stagnation point flow of tetra hybrid nanofluid past rotating sphere with activation energy by Munawar Abbas, Hawzhen Fateh M. Ameen, Jihad Younis, Nargiza Kamolova, Ebenezer Bonyah, Hafiz Muhammad Ghazi

    Published 2025-01-01
    “…Utilizing this model helps optimize energy systems such as solar collectors, increase the efficiency of chemical reactors, and improve heat and mass transfer in microelectronic cooling systems. Better performance and energy efficiency are ensured by its assistance in comprehending fluid behaviour in automotive and aerospace cooling mechanisms. …”
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    Article
  14. 314

    Crystallite size and phase purity in Pb1-xSrxTiO3 ferroelectric perovskites for biomedical applications via controlled sintering by Rahmat Doni Widodo, Samsudin Anis, Deni Fajar Fitriyana, Maykel Manawan, Joni Sah, Aji Santiko, Rizalman Bin Mamat, Abdulfatah Abdu Yusuf, Muhammad Imam Ammarullah

    Published 2024-10-01
    “…These findings emphasize the critical role of sintering temperature in tailoring PST’s properties, enhancing its suitability for electronic and microelectronic biomedical devices. Controlled sintering in perovskite materials opens new pathways for their application in medical diagnostics and therapeutic technologies.…”
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  15. 315

    Two-dimensional anion-rich NaCl2 crystal under ambient conditions by Ruobing Yi, Jie Jiang, Yizhou Yang, Yueyu Zhang, Siyan Gao, Yimin Zhao, Jiahao Hu, Xuchang Su, Xinming Xia, Bingquan Peng, Fangfang Dai, Pei Li, Zhao Guan, Haijun Yang, Fangyuan Zhu, Jiefeng Cao, Zhe Wang, Haiping Fang, Lei Zhang, Liang Chen

    Published 2025-01-01
    “…Abstract The two-dimensional (2D) “sandwich” structure composed of a cation plane located between two anion planes, such as anion-rich CrI3, VS2, VSe2, and MnSe2, possesses exotic magnetic and electronic structural properties and is expected to be a typical base for next-generation microelectronic, magnetic, and spintronic devices. However, only a few 2D anion-rich “sandwich” materials have been experimentally discovered and fabricated, as they are vastly limited by their conventional stoichiometric ratios and structural stability under ambient conditions. …”
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    Effect of Clip Characteristics on Thermal Performance of Dr.MOS Packages by Hao-Lin Yen, Fang-I Lai

    Published 2025-01-01
    “…This study explores the impact of copper clip design on the thermal performance of driver MOSFET (Dr.MOS) packages with the goal of optimizing heat dissipation efficiency in microelectronic components. The study examines four key variables: clip thickness, material, attachment material, and plating material. …”
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    Structure of Silicon Wafers Planar Surface before and after Rapid Thermal Treatment by U. A. Pilipenko, A. A. Sergeichik, D. V. Shestovski, V. A. Solodukha

    Published 2024-07-01
    “…Presently it is important to remove mechanically disturbed layer on wafer surface during creation of up-to-date microelectronic products. Rapid thermal treatment with optical pulses of second duration is one of the applicable methods for removing disturbances in crystal lattice emerging after ion implantation. …”
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    Orthogonal Components Forming of the Microprocessor-Based Protection Input Signals by F. A. Romaniuk, V. Yu. Rumiantsev, Yu. V. Rumiantsev, V. S. Kachenya

    Published 2020-08-01
    “…A block diagram of an OS equivalent signal generator has been developed, all blocks of which can be implemented according to known schemes on a microelectronic and microprocessor element base. The OS shaper model is implemented in the MatLab-Simulink dynamic modeling environment. …”
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