EQUIPMENT FOR NONDESTRUCTIVE TESTING OF SILICON WAFERS SUBMICRON TOPOLOGY DURING THE FABRICATION OF INTEGRATED CIRCUITS by S. A. Chizhik, S. P. Basalaev, V. A. Pilipenko, A. L. Khudoley, T. A. Kuznetsova, V. V. Chikunov, A. A. Suslov

“…The advantages of using an atomic force microscopy in manufacturing of submicron integrated circuits are described. The possibilities of characterizing the surface morphology and the etching profile for silicon substrate and bus lines, estimation of the periodicity and size of bus lines, geometrical stability for elementary bus line are shown. …”
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Cryogenic optical-to-microwave conversion using Si photonic integrated circuit Ge photodiodes by D. Julien-Neitzert, Edward K. Leung, N. Islam, S. Khorev, S. Shekhar, L. Chrostowski, Jeff F. Young, J. Salfi

“…Integrated circuit technology enables the scaling of circuit complexity and functionality while maintaining manufacturability and reliability. …”
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A Review of Test Stimulus Compression Methods for Ultra-Large-Scale Integrated Circuits by Liang Zhou, Daming Yang, Lei Chen, Wei Zhuang, Shiyuan Zhang, Yuanyuan Xiong

Subjects: “…integrated circuits…”
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Sensor Fusion in Integrated Circuit Fault Diagnosis Using a Belief Function Model by Daqi Zhu, Wei Gu

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Terahertz Integrated Circuits and Systems for High-Speed Wireless Communications: Challenges and Design Perspectives by Payam Heydari

“…This paper presents challenges and design perspectives for terahertz (THz) integrated circuits and systems. THz means different things to different people. …”
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Guest Editorial Special Section on Electronic–Photonic Integrated Circuits (EPIC) by Firooz Aflatouni

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Monitoring the reliability of integrated circuits protection against Trojans: encoding and decoding of combinational structures by L. A. Zolotorevich, V. A. Ilyinkov

“…Integrated circuits, systems on a chip are the key links in various industrial systems and state defense systems. …”
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Precise p-type and n-type doping of two-dimensional semiconductors for monolithic integrated circuits by Yu Pan, Tao Jian, Pingfan Gu, Yiwen Song, Qi Wang, Bo Han, Yuqia Ran, Zemin Pan, Yanping Li, Wanjin Xu, Peng Gao, Chendong Zhang, Jun He, Xiaolong Xu, Yu Ye

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A K‐band eight‐element reconfigurable phased‐array receiver with high Tx‐band rejection by Zhuoheng Xie, Shi Chao Jin, Jia Xing Sun, Dunge Liu, Bo Huang, Yuqian Yang, Chenyu Mei, Jinhuai Su, Jun Huang, Xiulong Wu, Lei Zhang

Subjects: “…integrated circuit design…”
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Temperature Monitoring in PIC Surface by Sushma Pandey, Antonio Teixeira, Mario Lima

Subjects: “…photonics integrated circuit…”
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A SET‐tolerant StrongARM comparator with improved performance by Chentian Zhou, Yuanyuan Han, Xu Cheng, Xiaoyang Zeng

Subjects: “…integrated circuit reliability…”
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APPLICATION OF EQUIPMENT FOR AUTOMATIC CONTROL OF PLANAR STRUCTURES IN MANUFACTURING MASTER MASKS OF INTEGRATED CIRCUITS ON PHOTO-MASKS by S. M. Avakov

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Feasibility Analysis of Using X-ray Inspection Systems for Assessing the Mass Thickness of Integrated Circuit Packages by Alexey S. Artamonov, Dmitry V. Boychenko, Anna S. Kameneva

Subjects: “…information systems security, mass thickness, integrated circuit packages, x-ray inspection system, nica nuclotron.…”
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Applying the carbon materials in TSVs array for enhancing heat transfer performance of three-dimensional integrated circuits by Peng Xu, Huan Huang, Songjie Zhao, Xiushan Liu, Fa Zou, Chao Li, Jun Ai, Hui Liu

“…This paper proposed the carbon materials (including MLGNR, MWCNT and SWCNT) to replace the traditional Cu as the filler of through silicon via (TSV) for enhancing heat transfer performance of three-dimensional integrated circuits (3-D ICs), meanwhile the corresponding mathematical model is established to quickly obtain steady-state temperature of each die layer. …”
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Graph-Based Symbolic Technique and Its Application in the Frequency Response Bound Analysis of Analog Integrated Circuits by E. Tlelo-Cuautle, S. Rodriguez-Chavez, A. A. Palma-Rodriguez

“…A new graph-based symbolic technique (GBST) for deriving exact analytical expressions like the transfer function H(s) of an analog integrated circuit (IC), is introduced herein. The derived H(s) of a given analog IC is used to compute the frequency response bounds (maximum and minimum) associated to the magnitude and phase of H(s), subject to some ranges of process variational parameters, and by performing nonlinear constrained optimization. …”
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Single Commercially Available Integrated Circuit-based Sinusoidal Oscillators with Amplitude Adjustability and Electronic Control of Condition by Suleeporn Duangkaew, Piya Supavarasuwat, Montree Siripruchyanun, Roman Sotner, Winai Jaikla, Wisuit Sunthonkanokpong

“…This paper presents four new sinusoidal oscillators using a commercially available integrated circuit (IC). The proposed circuits are simple topologies that employ a single commercial IC, LT1228. …”
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METHODS FOR OBTAINING SUB-PIXEL RESOLUTION DURING AUTOMATIC INSPECTION OF PATTERN MASTER MASKS OF INTEGRATED CIRCUITS by S. M. Avakov

“…The paper reveals significance and complexity of automatic inspection of pattern master masks of  integrated circuits under conditions of continuous decrease of  topological design specifications. …”
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A universal optoelectronic imaging platform with wafer-scale integration of two-dimensional semiconductors by Xinyu Wang, Die Wang, Yuchen Tian, Jing Guo, Jinshui Miao, Weida Hu, Hailu Wang, Kang Liu, Lei Shao, Saifei Gou, Xiangqi Dong, Hesheng Su, Chuming Sheng, Yuxuan Zhu, Zhejia Zhang, Jinshu Zhang, Qicheng Sun, Zihan Xu, Peng Zhou, Honglei Chen, Wenzhong Bao

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Training model for basic badminton techniques using sport integrated circuit for student athletes aged 12-15 Years by Septian Raibowo, Bogy Restu Ilahi, Yarmani Yarmani, Johanes Sapri, Dian Pujianto, Sudarwan Danim, Muhammad Kristiawan, Ardo Okilanda, Samsul Azhar, Wuri Syaputri

Subjects: “…Sport Integrated Circuit…”
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Overview of the detection and prevention study of hardware Trojans by Qiang XU, Xing-hao JIANG, Li-hong YAO, Zhi-qiang ZHANG, Cheng ZHANG

Subjects: “…integrated circuit chips…”
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