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    IMC growth mechanism of Sn58Bi/Cu solder joints and its effect on the coarsening of the Bi phase

    IMC growth mechanism of Sn58Bi/Cu solder joints and its effect on the coarsening of the Bi phase by Min Shang, Chenyu Li, Yanchen Wang, Xiangxu Chen, Yuanbang Zhao, Jingli Ke, Yunpeng Wang, Haitao Ma, Jun Chen

    Published 2024-11-01
    Subjects: “…Bi phase coarsening…”
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