A ZnTe Thin Film Memory Device by Marc Burgelman

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Characterization of Thick Film Capicitors by M. Vernet, M. Descamps, Y. Leroy

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Conference Diary

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Thick Film Thermal Print Heads by Peter Barnwell

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The Influence of the Area of a Thin Film Capacitor on the Breakdown Voltage by T. Berlicki

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AVI Transponder by Johji Sakuragi, Yoshinori Kimura, Shoichi Kamata

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High Voltage Ceramic Capacitors by D. A. Nicker

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The Use of Niobium as an Anode Material in Liquid Filled Electrolytic Capacitors by J. C. Hendy, N. F. Jackson

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Electrical Contacts to Evaporated Cadmium Selenide by G. de Mey

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Optimisation of Thin and Thick Film Technology for Hybrid Microwave Circuits by Werner Wiesbeck, Bernhard Rembold, Holger Meinel

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Reliability Considerations of Flip Chip Components for Automotive Electronic Applications by Iwao Tachikawa, Naoharu Tsuzimoto, Isao Bansaku, Keisuke Sugiyama

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A Hybrid Thin-Film Logic Circuit Using Gallium Arsenide Field Effect Transistors by A. C. Cross, R. A. Startin

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On the Sensitivity of Canonically Extended RC-Active Multiloop Filters by R. E. Massara

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Courses in Microelectronics at the Technical University, Budapest by K. Tarnay, A. Ambrózy

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Time Dependence of Ion-Migration Effects in NiCr Resistor Films by R. Hoffmann, U. Smith

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Solid State Metal-Ceramic Reaction Bonding Applications to Transistor Packages and Advanced Materials by R. V. Allen

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Size and Grain-Boundary Effects in the Electrical Conductivity of Thin Monocrystalline Films by C. R. Tellier

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Computer Aided Design of Hybrid Circuits by L. Piana, F. Francese, T. Cagnin, G. P. Ferraris

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Properties of Coplanar Type MIS-SIM Structure Chip Capacitor by S. K. Varshney, Y. K. Jain

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High Density Packaging Technology by Kazuo Mizuno, Yusaku Nishi

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