Tantalum Thin Film Capacitors With Various Types of Counterelectrodes by R. May, G. P. Ferraris

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Response to Comments on Paper on Grain Boundary Scattering Model for Metals by F. Warkusz

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Conduction Processes in Thick Film Resistors. Part II by M. P. Ansell

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Some Useful Design Parameters of Non-Uniform Integrated Band-Pass Filters by H. R. Singh

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New Approaches to the Direct Measurement of Capacitance by D. Raven, M. S. Raven

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Underwater Acoustic Measurements on Polyvinylidene Fluoride Transducers by R. C. Chandra, B. Woodward

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Processing Considerations of Thick Film Devices With Multilayered Resistors by Akira Ikegami, Nobuyuki Sugishita, Tsuneo Endo

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Hybrid Electronic Watt-Hour Meter by M. Hrovat, F. Jan, L. Trontelj, J. Trontelj

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Principe d'un Analyseur de Spectre Optique Utilisant les Couches Minces Pulverisees by H. Murray

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Announcement

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Design of Wide Band Amplifiers Using Hybrid Integrated Techniques by Aurel Sonkoly

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New Thick Film Functional Devices by M. Haradome, O. Abe, Y. Taketa

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Silicon and Hybrid Micro-Electronic Sensors by G. K. Steenvoorden, D. J. W. Noorlag, S. Middelhoek

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Wire Wrapped Joints—A Review by P. M. A. Sollars

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Gold-Aluminium Intermetallic Compound Formation by C. Nobili, G. Majni, E. Galli, G. Ottaviani

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A Short Communication — Determination of Chip and Substrate Temperatures by M. R. Haskard

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Electrical Behaviour of Langmuir Films: A Review, Part I by V. K. Agarwal

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Epoxies for Component Mounting in Thick Film Hybrids by C. Marshall

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Reliability Assessment and Screening by Reliability Indicator Methods by Jørgen Møltoft

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Adequate Use of the Cottey Model for the Description of Conduction in Polycrystalline Films by A. J. Tosser, C. R. Tellier

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