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A High-Efficiency Charge-Domain Compute-in-Memory 1F1C Macro Using 2-bit FeFET Cells for DNN Processing
Published 2024-01-01Subjects: “…artificial intelligence (AI) accelerator…”
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Heterogeneous Integration Technologies for Artificial Intelligence Applications
Published 2024-01-01“…HI is becoming increasingly implemented in many AI accelerator products due to its potential to enhance overall system performance while also reducing electrical interconnect delays and energy consumption, which are critical for supporting data-intensive AI workloads. …”
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Evaluation of Novel AI Architectures for Uncertainty Estimation
Published 2024-12-01“…Using High-Performance (HPC) platforms, including the traditional Polaris supercomputer and AI accelerators like Cerebras CS-2 and SambaNova DataScale, we assessed the computational merits and bottlenecks of each platform. …”
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Thermal Heating in ReRAM Crossbar Arrays: Challenges and Solutions
Published 2024-01-01“…The high speed, scalability, and parallelism offered by ReRAM crossbar arrays foster the development of ReRAM-based next-generation AI accelerators. At the same time, the sensitivity of ReRAM to temperature variations decreases <inline-formula> <tex-math notation="LaTeX">$\text{R}_{ON}/\text{R}_{OFF}$ </tex-math></inline-formula> ratio and negatively affects the achieved accuracy and reliability of the hardware. …”
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Co-Optimization of Power Delivery Network Design for 3-D Heterogeneous Integration of RRAM-Based Compute In-Memory Accelerators
Published 2025-01-01“…Three-dimensional heterogeneous integration (3D-HI) offers promising solutions for incorporating substantial embedded memory into cutting-edge analog compute-in-memory (CIM) AI accelerators, addressing the need for on-chip acceleration of large AI models. …”
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