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    3D laser structuring of supermetalphobic microstructures inside elastomer for multilayer high-density interconnect soft electronics

    3D laser structuring of supermetalphobic microstructures inside elastomer for multilayer high-density interconnect soft electronics by Chengjun Zhang, Qing Yang, Haoyu Li, Zexiang Luo, Yu Lu, Jialiang Zhang, Cheng Li, Feng Chen

    Published 2025-01-01
    Subjects: “…3D soft electronics…”
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