Enhancing the Interfacial Property Between UHMWPE Fibers and Epoxy Through Polydopamine and SiO2 Surface Modification

Abstract Here, a combination of dopamine self‐polymerization and epoxy modified SiO2 (M‐SiO2) grafting was proposed, with the purpose of increasing interfacial adhesion of UHMWPE fiber. Inspired by mussel adhesion, polydopamine (PDA) was deposited onto the surface of UHMWPE fiber to form a thin laye...

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Main Authors: Nengjun Ben, Sulun Jiang, Liping Zhao, Jiale Gong, Lu Shen, Kui Wang, Chenyang Tang
Format: Article
Language:English
Published: Wiley-VCH 2025-01-01
Series:ChemistryOpen
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Online Access:https://doi.org/10.1002/open.202400131
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author Nengjun Ben
Sulun Jiang
Liping Zhao
Jiale Gong
Lu Shen
Kui Wang
Chenyang Tang
author_facet Nengjun Ben
Sulun Jiang
Liping Zhao
Jiale Gong
Lu Shen
Kui Wang
Chenyang Tang
author_sort Nengjun Ben
collection DOAJ
description Abstract Here, a combination of dopamine self‐polymerization and epoxy modified SiO2 (M‐SiO2) grafting was proposed, with the purpose of increasing interfacial adhesion of UHMWPE fiber. Inspired by mussel adhesion, polydopamine (PDA) was deposited onto the surface of UHMWPE fiber to form a thin layer with amino and hydroxyl groups. M‐SiO2 nanoparticles were then adhered to fiber surface via chemical reactions by a “two‐step” or “one‐step” technology. In the “two‐step” technique, the M‐SiO2 nanoparticles were adhered to the surface of PDA modified UHMWPE fiber via reactions between epoxy and amino groups. In the “one‐step” method, M‐SiO2 and dopamine were added into the UHMWPE/Tris solution at the same time. Surface morphology and thermal properties of various UHMWPE fibers were tested by SEM and TGA, respectively. Surface wettability of different UHMWPE fibers were evaluated by dynamic contact angle. The results proved that PDA and M‐SiO2 were successfully adhered to the surface of UHMWPE fibers. The mechanical property of modified UHMWPE/Epoxy composites was investigated, and 43.7 % improvement was obtained, compared with unmodified UHMWPE/Epoxy composite. Additionally, micro‐bond test revealed that the interfacial property (IFSS value) of modified UHMWPE fiber via the “one‐step” method was 6.08 MPa, significantly higher than that of unmodified UHMWPE fiber (2.47 MPa).
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institution Kabale University
issn 2191-1363
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spelling doaj-art-fea170f6020c4b269491cb2fc66261f92025-01-11T07:54:10ZengWiley-VCHChemistryOpen2191-13632025-01-01141n/an/a10.1002/open.202400131Enhancing the Interfacial Property Between UHMWPE Fibers and Epoxy Through Polydopamine and SiO2 Surface ModificationNengjun Ben0Sulun Jiang1Liping Zhao2Jiale Gong3Lu Shen4Kui Wang5Chenyang Tang6Intelligent agricultural equipment collaborative innovation center of Ministry of Education Yancheng Polytechnic College South Jiefang Road No. 285 Yancheng 224051 PR ChinaSchool of Materials Science and Engineering Yancheng Institute of Technology Hope Avenue Road No.1 Yancheng 224051 PR ChinaInstitute of Chemical and Industrial Bioengineering Jilin Engineering Normal University Kaixuan Road No. 3050 Changchun 130052 PR ChinaSchool of Materials Science and Engineering Yancheng Institute of Technology Hope Avenue Road No.1 Yancheng 224051 PR ChinaSchool of Materials Science and Engineering Yancheng Institute of Technology Hope Avenue Road No.1 Yancheng 224051 PR ChinaSchool of Materials Science and Engineering Yancheng Institute of Technology Hope Avenue Road No.1 Yancheng 224051 PR ChinaSchool of Materials Science and Engineering Yancheng Institute of Technology Hope Avenue Road No.1 Yancheng 224051 PR ChinaAbstract Here, a combination of dopamine self‐polymerization and epoxy modified SiO2 (M‐SiO2) grafting was proposed, with the purpose of increasing interfacial adhesion of UHMWPE fiber. Inspired by mussel adhesion, polydopamine (PDA) was deposited onto the surface of UHMWPE fiber to form a thin layer with amino and hydroxyl groups. M‐SiO2 nanoparticles were then adhered to fiber surface via chemical reactions by a “two‐step” or “one‐step” technology. In the “two‐step” technique, the M‐SiO2 nanoparticles were adhered to the surface of PDA modified UHMWPE fiber via reactions between epoxy and amino groups. In the “one‐step” method, M‐SiO2 and dopamine were added into the UHMWPE/Tris solution at the same time. Surface morphology and thermal properties of various UHMWPE fibers were tested by SEM and TGA, respectively. Surface wettability of different UHMWPE fibers were evaluated by dynamic contact angle. The results proved that PDA and M‐SiO2 were successfully adhered to the surface of UHMWPE fibers. The mechanical property of modified UHMWPE/Epoxy composites was investigated, and 43.7 % improvement was obtained, compared with unmodified UHMWPE/Epoxy composite. Additionally, micro‐bond test revealed that the interfacial property (IFSS value) of modified UHMWPE fiber via the “one‐step” method was 6.08 MPa, significantly higher than that of unmodified UHMWPE fiber (2.47 MPa).https://doi.org/10.1002/open.202400131InterfacesNanoparticlesNanostructuresPolymersSilicon
spellingShingle Nengjun Ben
Sulun Jiang
Liping Zhao
Jiale Gong
Lu Shen
Kui Wang
Chenyang Tang
Enhancing the Interfacial Property Between UHMWPE Fibers and Epoxy Through Polydopamine and SiO2 Surface Modification
ChemistryOpen
Interfaces
Nanoparticles
Nanostructures
Polymers
Silicon
title Enhancing the Interfacial Property Between UHMWPE Fibers and Epoxy Through Polydopamine and SiO2 Surface Modification
title_full Enhancing the Interfacial Property Between UHMWPE Fibers and Epoxy Through Polydopamine and SiO2 Surface Modification
title_fullStr Enhancing the Interfacial Property Between UHMWPE Fibers and Epoxy Through Polydopamine and SiO2 Surface Modification
title_full_unstemmed Enhancing the Interfacial Property Between UHMWPE Fibers and Epoxy Through Polydopamine and SiO2 Surface Modification
title_short Enhancing the Interfacial Property Between UHMWPE Fibers and Epoxy Through Polydopamine and SiO2 Surface Modification
title_sort enhancing the interfacial property between uhmwpe fibers and epoxy through polydopamine and sio2 surface modification
topic Interfaces
Nanoparticles
Nanostructures
Polymers
Silicon
url https://doi.org/10.1002/open.202400131
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