Running-In Behavior and Failure Mechanism Between AgCuNi Alloy and Au-Electroplated Layer

Running-In Behavior and Failure Mechanism Between AgCuNi Alloy and Au-Electroplated Layer

To avoid wear and tear of the slip ring due to electrical corrosion, the slip ring needs to undergo the running-in process under atmospheric conditions without current after assembly. To address the urgent demand for long-service capability space conductive slip rings in the aerospace field, the run...

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Bibliographic Details
Main Authors: Hongjian Wu, Ya’nan Zhang, Qingjian Jia, Hui Cao, Han Li, Ming Ma
Format: Article
Language:English
Published: MDPI AG 2024-12-01
Series:Sensors
Subjects:
friction behavior
transfer film
AgCuNi
Au-electroplated layer
Online Access:https://www.mdpi.com/1424-8220/25/1/107
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