APA (7th ed.) Citation

Wu, H., Zhang, Y., Jia, Q., Cao, H., Li, H., & Ma, M. Running-In Behavior and Failure Mechanism Between AgCuNi Alloy and Au-Electroplated Layer. MDPI AG.

Chicago Style (17th ed.) Citation

Wu, Hongjian, Ya’nan Zhang, Qingjian Jia, Hui Cao, Han Li, and Ming Ma. Running-In Behavior and Failure Mechanism Between AgCuNi Alloy and Au-Electroplated Layer. MDPI AG.

MLA (9th ed.) Citation

Wu, Hongjian, et al. Running-In Behavior and Failure Mechanism Between AgCuNi Alloy and Au-Electroplated Layer. MDPI AG.