Double-Sided Fabrication of Low-Leakage-Current Through-Silicon Vias (TSVs) with High-Step-Coverage Liner/Barrier Layers
In this paper, a novel through-silicon via (TSV) fabrication strategy based on through-hole structures is proposed for low-cost and low-complexity manufacturing. Compared to conventional TSV fabrication processes, this method significantly simplifies the process flow by employing double-sided liner...
Saved in:
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-06-01
|
| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/16/7/750 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|