A novel strategy for activation technique for 6H-SiC substrates in electroless Ni-P plating processes
This study proposes a novel iron wire activation method for electroless Ni-P plating on 6H-SiC substrates, offering a sustainable alternative to traditional metal activation techniques, focusing on the surface roughness effect on the microhardness and Ni-P plating efficiency of 6H-SiC substrates. Th...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-12-01
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| Series: | Results in Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2590123024013811 |
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