A novel strategy for activation technique for 6H-SiC substrates in electroless Ni-P plating processes
This study proposes a novel iron wire activation method for electroless Ni-P plating on 6H-SiC substrates, offering a sustainable alternative to traditional metal activation techniques, focusing on the surface roughness effect on the microhardness and Ni-P plating efficiency of 6H-SiC substrates. Th...
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| Format: | Article |
| Language: | English |
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Elsevier
2024-12-01
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| Series: | Results in Engineering |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2590123024013811 |
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| author | Hossein Ahmadian Tianfeng Zhou Weijia Guo Qian Yu A.M. Sadoun A. Fathy A. Wagih |
| author_facet | Hossein Ahmadian Tianfeng Zhou Weijia Guo Qian Yu A.M. Sadoun A. Fathy A. Wagih |
| author_sort | Hossein Ahmadian |
| collection | DOAJ |
| description | This study proposes a novel iron wire activation method for electroless Ni-P plating on 6H-SiC substrates, offering a sustainable alternative to traditional metal activation techniques, focusing on the surface roughness effect on the microhardness and Ni-P plating efficiency of 6H-SiC substrates. This experimental approach reveals insights into the relationship between substrate morphology and plating characteristics. It is found that the plating thickness (33.82 μm) of the non-polished substrates closely matched the expected (33.26 μm), with a deposition rate of 6.65 μm/h, which underscores the precision regulation of the plating process. In contrast, despite the faster deposition rate of 9.20 μm/h of the polished S500 substrate, it exhibited a minor thickness discrepancy, suggesting a saturation point in the deposition dynamics on fully polished surfaces. The research additionally sheds light on the adhesion characteristics of the plated layers, particularly emphasizing the role of surface roughness. Remarkably, non-polished substrates demonstrated better adhesion, categorized as HF3, indicating a significantly stronger bond compared to the polished substrates, which were categorized as HF4 to HF6. This distinction in adhesion categories underlines the critical influence of substrate morphology on the quality of the Ni-P layer's adherence. |
| format | Article |
| id | doaj-art-f67c1ea5ebd140cf97e8e6922a4f9e95 |
| institution | Kabale University |
| issn | 2590-1230 |
| language | English |
| publishDate | 2024-12-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Results in Engineering |
| spelling | doaj-art-f67c1ea5ebd140cf97e8e6922a4f9e952024-12-19T10:58:16ZengElsevierResults in Engineering2590-12302024-12-0124103126A novel strategy for activation technique for 6H-SiC substrates in electroless Ni-P plating processesHossein Ahmadian0Tianfeng Zhou1Weijia Guo2Qian Yu3A.M. Sadoun4A. Fathy5A. Wagih6Department of Mechanical Engineering, Beijing Institute of Technology, Beijing, 300081, ChinaDepartment of Mechanical Engineering, Beijing Institute of Technology, Beijing, 300081, ChinaDepartment of Mechanical Engineering, Beijing Institute of Technology, Beijing, 300081, China; Corresponding author.Department of Mechanical Engineering, Beijing Institute of Technology, Beijing, 300081, ChinaMechanical Engineering Department, Faculty of Engineering, King Abdulaziz University, P.O. Box 80204, Jeddah, Saudi Arabia; Corresponding author.Department of Mechanical Design and Production Engineering, Faculty of Engineering, Zagazig University, P.O. Box 44519, EgyptDepartment of Mechanical Design and Production Engineering, Faculty of Engineering, Zagazig University, P.O. Box 44519, Egypt; Mechanics of Composites For Energy and Mobility Lab, Physical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal, 23955-6900, Kingdom of Saudi ArabiaThis study proposes a novel iron wire activation method for electroless Ni-P plating on 6H-SiC substrates, offering a sustainable alternative to traditional metal activation techniques, focusing on the surface roughness effect on the microhardness and Ni-P plating efficiency of 6H-SiC substrates. This experimental approach reveals insights into the relationship between substrate morphology and plating characteristics. It is found that the plating thickness (33.82 μm) of the non-polished substrates closely matched the expected (33.26 μm), with a deposition rate of 6.65 μm/h, which underscores the precision regulation of the plating process. In contrast, despite the faster deposition rate of 9.20 μm/h of the polished S500 substrate, it exhibited a minor thickness discrepancy, suggesting a saturation point in the deposition dynamics on fully polished surfaces. The research additionally sheds light on the adhesion characteristics of the plated layers, particularly emphasizing the role of surface roughness. Remarkably, non-polished substrates demonstrated better adhesion, categorized as HF3, indicating a significantly stronger bond compared to the polished substrates, which were categorized as HF4 to HF6. This distinction in adhesion categories underlines the critical influence of substrate morphology on the quality of the Ni-P layer's adherence.http://www.sciencedirect.com/science/article/pii/S2590123024013811Electroless Ni-P platingSiC substratesWire activation techniqueSurface roughnessMicrohardnessAdhesion strength |
| spellingShingle | Hossein Ahmadian Tianfeng Zhou Weijia Guo Qian Yu A.M. Sadoun A. Fathy A. Wagih A novel strategy for activation technique for 6H-SiC substrates in electroless Ni-P plating processes Results in Engineering Electroless Ni-P plating SiC substrates Wire activation technique Surface roughness Microhardness Adhesion strength |
| title | A novel strategy for activation technique for 6H-SiC substrates in electroless Ni-P plating processes |
| title_full | A novel strategy for activation technique for 6H-SiC substrates in electroless Ni-P plating processes |
| title_fullStr | A novel strategy for activation technique for 6H-SiC substrates in electroless Ni-P plating processes |
| title_full_unstemmed | A novel strategy for activation technique for 6H-SiC substrates in electroless Ni-P plating processes |
| title_short | A novel strategy for activation technique for 6H-SiC substrates in electroless Ni-P plating processes |
| title_sort | novel strategy for activation technique for 6h sic substrates in electroless ni p plating processes |
| topic | Electroless Ni-P plating SiC substrates Wire activation technique Surface roughness Microhardness Adhesion strength |
| url | http://www.sciencedirect.com/science/article/pii/S2590123024013811 |
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