Design and Optimization of a Fan-Out Wafer-Level Packaging- Based Integrated Passive Device Structure for FMCW Radar Applications

Design and Optimization of a Fan-Out Wafer-Level Packaging- Based Integrated Passive Device Structure for FMCW Radar Applications

This paper presents an integrated passive device (IPD) structure based on fan-out wafer-level packaging (FOWLP) for the front end of frequency-modulated continuous wave (FMCW) radar systems, focusing on enhancing the integration efficiency and performance of large passive components like antennas. A...

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Bibliographic Details
Main Authors: Jiajie Yang, Lixin Xu, Ke Yang
Format: Article
Language:English
Published: MDPI AG 2024-10-01
Series:Micromachines
Subjects:
integrated passive device
fan-out wafer level package
electromagnetic simulation
surrogate model
optimization
Online Access:https://www.mdpi.com/2072-666X/15/11/1311
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