Design and Optimization of a Fan-Out Wafer-Level Packaging- Based Integrated Passive Device Structure for FMCW Radar Applications
This paper presents an integrated passive device (IPD) structure based on fan-out wafer-level packaging (FOWLP) for the front end of frequency-modulated continuous wave (FMCW) radar systems, focusing on enhancing the integration efficiency and performance of large passive components like antennas. A...
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MDPI AG
2024-10-01
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| Online Access: | https://www.mdpi.com/2072-666X/15/11/1311 |
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| author | Jiajie Yang Lixin Xu Ke Yang |
| author_facet | Jiajie Yang Lixin Xu Ke Yang |
| author_sort | Jiajie Yang |
| collection | DOAJ |
| description | This paper presents an integrated passive device (IPD) structure based on fan-out wafer-level packaging (FOWLP) for the front end of frequency-modulated continuous wave (FMCW) radar systems, focusing on enhancing the integration efficiency and performance of large passive components like antennas. Additionally, a new metric is introduced to assess this structure’s effect on the average noise figure in FMCW systems. Using this metric as a loss function, we apply the support vector machine (SVM) for electromagnetic simulation and the genetic algorithm (GA) for optimization. The sample fitting variance is 2.42 dB, reducing computation time from 12 min to under 1 millisecond, with the entire optimization completed in less than 100 s. The optimized IPD structure is 0.7 × 0.9 × 0.014 <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><msup><mrow><msub><mi>λ</mi><mn>0</mn></msub></mrow><mn>3</mn></msup></semantics></math></inline-formula> in size and achieves over 35 dB isolation between the transmitter and receiver. Compared to the IPD model calculated by empirical formulas, the optimized device lowers the average noise figure by 15.2 dB and increases maximum gain by 4.19 dB. |
| format | Article |
| id | doaj-art-f64cde8e50d3490288cc56ca81be0732 |
| institution | Kabale University |
| issn | 2072-666X |
| language | English |
| publishDate | 2024-10-01 |
| publisher | MDPI AG |
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| series | Micromachines |
| spelling | doaj-art-f64cde8e50d3490288cc56ca81be07322024-11-26T18:13:48ZengMDPI AGMicromachines2072-666X2024-10-011511131110.3390/mi15111311Design and Optimization of a Fan-Out Wafer-Level Packaging- Based Integrated Passive Device Structure for FMCW Radar ApplicationsJiajie Yang0Lixin Xu1Ke Yang2School of Mechatronical Engineering, Beijing Institute of Technology, Beijing 100081, ChinaSchool of Mechatronical Engineering, Beijing Institute of Technology, Beijing 100081, ChinaSchool of Mechatronical Engineering, Beijing Institute of Technology, Beijing 100081, ChinaThis paper presents an integrated passive device (IPD) structure based on fan-out wafer-level packaging (FOWLP) for the front end of frequency-modulated continuous wave (FMCW) radar systems, focusing on enhancing the integration efficiency and performance of large passive components like antennas. Additionally, a new metric is introduced to assess this structure’s effect on the average noise figure in FMCW systems. Using this metric as a loss function, we apply the support vector machine (SVM) for electromagnetic simulation and the genetic algorithm (GA) for optimization. The sample fitting variance is 2.42 dB, reducing computation time from 12 min to under 1 millisecond, with the entire optimization completed in less than 100 s. The optimized IPD structure is 0.7 × 0.9 × 0.014 <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><msup><mrow><msub><mi>λ</mi><mn>0</mn></msub></mrow><mn>3</mn></msup></semantics></math></inline-formula> in size and achieves over 35 dB isolation between the transmitter and receiver. Compared to the IPD model calculated by empirical formulas, the optimized device lowers the average noise figure by 15.2 dB and increases maximum gain by 4.19 dB.https://www.mdpi.com/2072-666X/15/11/1311integrated passive devicefan-out wafer level packageelectromagnetic simulationsurrogate modeloptimization |
| spellingShingle | Jiajie Yang Lixin Xu Ke Yang Design and Optimization of a Fan-Out Wafer-Level Packaging- Based Integrated Passive Device Structure for FMCW Radar Applications Micromachines integrated passive device fan-out wafer level package electromagnetic simulation surrogate model optimization |
| title | Design and Optimization of a Fan-Out Wafer-Level Packaging- Based Integrated Passive Device Structure for FMCW Radar Applications |
| title_full | Design and Optimization of a Fan-Out Wafer-Level Packaging- Based Integrated Passive Device Structure for FMCW Radar Applications |
| title_fullStr | Design and Optimization of a Fan-Out Wafer-Level Packaging- Based Integrated Passive Device Structure for FMCW Radar Applications |
| title_full_unstemmed | Design and Optimization of a Fan-Out Wafer-Level Packaging- Based Integrated Passive Device Structure for FMCW Radar Applications |
| title_short | Design and Optimization of a Fan-Out Wafer-Level Packaging- Based Integrated Passive Device Structure for FMCW Radar Applications |
| title_sort | design and optimization of a fan out wafer level packaging based integrated passive device structure for fmcw radar applications |
| topic | integrated passive device fan-out wafer level package electromagnetic simulation surrogate model optimization |
| url | https://www.mdpi.com/2072-666X/15/11/1311 |
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