APA (7th ed.) Citation

Yang, J., Xu, L., & Yang, K. Design and Optimization of a Fan-Out Wafer-Level Packaging- Based Integrated Passive Device Structure for FMCW Radar Applications. MDPI AG.

Chicago Style (17th ed.) Citation

Yang, Jiajie, Lixin Xu, and Ke Yang. Design and Optimization of a Fan-Out Wafer-Level Packaging- Based Integrated Passive Device Structure for FMCW Radar Applications. MDPI AG.

MLA (9th ed.) Citation

Yang, Jiajie, et al. Design and Optimization of a Fan-Out Wafer-Level Packaging- Based Integrated Passive Device Structure for FMCW Radar Applications. MDPI AG.