Toward Fine-Grained Partitioning of Low-Level SRAM Caches for Emerging 3D-IC Designs
Scaling on-chip memory capacity is one of the primary approaches to mitigate memory wall bottlenecks. Various 2.5-D/3-D integration schemes, leveraging novel partitioning, are being actively explored to improve system performance. However, fine-grained functional partitioning of memory macros is not...
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| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2024-01-01
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| Series: | IEEE Journal on Exploratory Solid-State Computational Devices and Circuits |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10695147/ |
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