Mounting of Micropackages in Vapour Phase Soldering and Study of Ageing Mechanism

Mounting of Micropackages in Vapour Phase Soldering and Study of Ageing Mechanism

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Bibliographic Details
Main Authors:	Jacques D. Agniel, Christian M. Val
Format:	Article
Language:	English
Published:	Wiley 1983-01-01
Series:	Active and Passive Electronic Components
Online Access:	http://dx.doi.org/10.1155/APEC.10.111
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