Novel Porous Gold Microspheres Anisotropic Conductive Film (PGMS‐ACF) with High Compression Ratio for Flip Chip Packaging

Abstract The preparation of conductive filler is a key technology in anisotropic conductive films preparation. In recent decades, research on the preparation of novel conductive particles has reached a bottleneck. Porous gold materials exhibit high compressibility, low density, and excellent conduct...

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Bibliographic Details
Main Authors: Li Zhang, Zhaomeng Wang, Geng Wei, Puyue Xia, Sining Fan, Wenhao Zhang, Shaolong Tang
Format: Article
Language:English
Published: Wiley-VCH 2025-08-01
Series:Advanced Electronic Materials
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Online Access:https://doi.org/10.1002/aelm.202500045
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