APA (7th ed.) Citation

Zhang, L., Wang, Z., Wei, G., Xia, P., Fan, S., Zhang, W., & Tang, S. Novel Porous Gold Microspheres Anisotropic Conductive Film (PGMS‐ACF) with High Compression Ratio for Flip Chip Packaging. Wiley-VCH.

Chicago Style (17th ed.) Citation

Zhang, Li, Zhaomeng Wang, Geng Wei, Puyue Xia, Sining Fan, Wenhao Zhang, and Shaolong Tang. Novel Porous Gold Microspheres Anisotropic Conductive Film (PGMS‐ACF) with High Compression Ratio for Flip Chip Packaging. Wiley-VCH.

MLA (9th ed.) Citation

Zhang, Li, et al. Novel Porous Gold Microspheres Anisotropic Conductive Film (PGMS‐ACF) with High Compression Ratio for Flip Chip Packaging. Wiley-VCH.