Thermal Performance Analysis of High-power IGBT Module Based on ANSYS
A three-dimensional FEA model of IGBT module is constructed by utilizing finite element analysis of ANSYS. Temperature distribution of the model under steady condition is analyzed and effects of baseplate material and thickness, solder material and layer thickness on thermal conduction performance o...
Saved in:
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Control and Information Technology
2012-01-01
|
| Series: | Kongzhi Yu Xinxi Jishu |
| Subjects: | |
| Online Access: | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2012.02.002 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1849224841924706304 |
|---|---|
| author | FANG Jie CHANG Guiqin PENG Yongdian LI Jilu TANG Longgu |
| author_facet | FANG Jie CHANG Guiqin PENG Yongdian LI Jilu TANG Longgu |
| author_sort | FANG Jie |
| collection | DOAJ |
| description | A three-dimensional FEA model of IGBT module is constructed by utilizing finite element analysis of ANSYS. Temperature distribution of the model under steady condition is analyzed and effects of baseplate material and thickness, solder material and layer thickness on thermal conduction performance of IGBT module are studied. |
| format | Article |
| id | doaj-art-eb5b63d385e84f86aadc78fb17ec46f1 |
| institution | Kabale University |
| issn | 2096-5427 |
| language | zho |
| publishDate | 2012-01-01 |
| publisher | Editorial Office of Control and Information Technology |
| record_format | Article |
| series | Kongzhi Yu Xinxi Jishu |
| spelling | doaj-art-eb5b63d385e84f86aadc78fb17ec46f12025-08-25T06:52:41ZzhoEditorial Office of Control and Information TechnologyKongzhi Yu Xinxi Jishu2096-54272012-01-0129162082338772Thermal Performance Analysis of High-power IGBT Module Based on ANSYSFANG JieCHANG GuiqinPENG YongdianLI JiluTANG LongguA three-dimensional FEA model of IGBT module is constructed by utilizing finite element analysis of ANSYS. Temperature distribution of the model under steady condition is analyzed and effects of baseplate material and thickness, solder material and layer thickness on thermal conduction performance of IGBT module are studied.http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2012.02.002IGBT modulesolder layer thicknesssolderbaseplate thicknessbaseplate materialthermal analysisfinite element analysis |
| spellingShingle | FANG Jie CHANG Guiqin PENG Yongdian LI Jilu TANG Longgu Thermal Performance Analysis of High-power IGBT Module Based on ANSYS Kongzhi Yu Xinxi Jishu IGBT module solder layer thickness solder baseplate thickness baseplate material thermal analysis finite element analysis |
| title | Thermal Performance Analysis of High-power IGBT Module Based on ANSYS |
| title_full | Thermal Performance Analysis of High-power IGBT Module Based on ANSYS |
| title_fullStr | Thermal Performance Analysis of High-power IGBT Module Based on ANSYS |
| title_full_unstemmed | Thermal Performance Analysis of High-power IGBT Module Based on ANSYS |
| title_short | Thermal Performance Analysis of High-power IGBT Module Based on ANSYS |
| title_sort | thermal performance analysis of high power igbt module based on ansys |
| topic | IGBT module solder layer thickness solder baseplate thickness baseplate material thermal analysis finite element analysis |
| url | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2012.02.002 |
| work_keys_str_mv | AT fangjie thermalperformanceanalysisofhighpowerigbtmodulebasedonansys AT changguiqin thermalperformanceanalysisofhighpowerigbtmodulebasedonansys AT pengyongdian thermalperformanceanalysisofhighpowerigbtmodulebasedonansys AT lijilu thermalperformanceanalysisofhighpowerigbtmodulebasedonansys AT tanglonggu thermalperformanceanalysisofhighpowerigbtmodulebasedonansys |