Exploring Surface-Driven Mechanisms for Low-Temperature Sintering of Nanoscale Copper
As the density of electronic packaging continues to rise, traditional soldering techniques encounter significant challenges, leading to copper–copper direct bonding as a new high-density connection method. The high melting point of copper presents difficulties for direct diffusion bonding under stan...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-01-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/15/1/476 |
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