Exploring Surface-Driven Mechanisms for Low-Temperature Sintering of Nanoscale Copper
As the density of electronic packaging continues to rise, traditional soldering techniques encounter significant challenges, leading to copper–copper direct bonding as a new high-density connection method. The high melting point of copper presents difficulties for direct diffusion bonding under stan...
Saved in:
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-01-01
|
| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/15/1/476 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1841549390100037632 |
|---|---|
| author | Jingyan Li Zixian Song Zhichao Liu Xianli Xie Penghui Guan Yiying Zhu |
| author_facet | Jingyan Li Zixian Song Zhichao Liu Xianli Xie Penghui Guan Yiying Zhu |
| author_sort | Jingyan Li |
| collection | DOAJ |
| description | As the density of electronic packaging continues to rise, traditional soldering techniques encounter significant challenges, leading to copper–copper direct bonding as a new high-density connection method. The high melting point of copper presents difficulties for direct diffusion bonding under standard conditions, thus making low-temperature copper–copper bonding a focal point of research. In this study, we examine the sintering process at various temperatures by constructing models with multiple nanoparticles and sintering them under different conditions. Our findings indicate that 600 K is a crucial temperature for direct copper–copper sintering. Below this threshold, sintering predominantly depends on structural adjustments driven by residual stresses and particle contact. Conversely, at temperatures of 600 K and above, the activation of rapid surface atomic motion enables further structural adjustments between nanoparticles, leading to a marked decrease in porosity. Mechanical testing of the sintered samples corroborated the structural changes at different temperatures, demonstrating that the surface dynamic motion of atoms inherent in low-temperature sintering mechanisms significantly affects the mechanical properties of nanomaterials. These findings have important implications for developing high-performance materials that align with the evolving requirements of modern electronic devices. |
| format | Article |
| id | doaj-art-e94bc68aa55d4c1c99bc0fe6ad6a1681 |
| institution | Kabale University |
| issn | 2076-3417 |
| language | English |
| publishDate | 2025-01-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Applied Sciences |
| spelling | doaj-art-e94bc68aa55d4c1c99bc0fe6ad6a16812025-01-10T13:15:41ZengMDPI AGApplied Sciences2076-34172025-01-0115147610.3390/app15010476Exploring Surface-Driven Mechanisms for Low-Temperature Sintering of Nanoscale CopperJingyan Li0Zixian Song1Zhichao Liu2Xianli Xie3Penghui Guan4Yiying Zhu5State Key Laboratory of Intelligent Vehicle Safety Technology, Chongqing 400023, ChinaSchool of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, ChinaSchool of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, ChinaState Key Laboratory of Intelligent Vehicle Safety Technology, Chongqing 400023, ChinaState Key Laboratory of Intelligent Vehicle Safety Technology, Chongqing 400023, ChinaSchool of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, ChinaAs the density of electronic packaging continues to rise, traditional soldering techniques encounter significant challenges, leading to copper–copper direct bonding as a new high-density connection method. The high melting point of copper presents difficulties for direct diffusion bonding under standard conditions, thus making low-temperature copper–copper bonding a focal point of research. In this study, we examine the sintering process at various temperatures by constructing models with multiple nanoparticles and sintering them under different conditions. Our findings indicate that 600 K is a crucial temperature for direct copper–copper sintering. Below this threshold, sintering predominantly depends on structural adjustments driven by residual stresses and particle contact. Conversely, at temperatures of 600 K and above, the activation of rapid surface atomic motion enables further structural adjustments between nanoparticles, leading to a marked decrease in porosity. Mechanical testing of the sintered samples corroborated the structural changes at different temperatures, demonstrating that the surface dynamic motion of atoms inherent in low-temperature sintering mechanisms significantly affects the mechanical properties of nanomaterials. These findings have important implications for developing high-performance materials that align with the evolving requirements of modern electronic devices.https://www.mdpi.com/2076-3417/15/1/476low-temperature sinteringnanoparticlesurface atomic motionmolecular dynamic simulation |
| spellingShingle | Jingyan Li Zixian Song Zhichao Liu Xianli Xie Penghui Guan Yiying Zhu Exploring Surface-Driven Mechanisms for Low-Temperature Sintering of Nanoscale Copper Applied Sciences low-temperature sintering nanoparticle surface atomic motion molecular dynamic simulation |
| title | Exploring Surface-Driven Mechanisms for Low-Temperature Sintering of Nanoscale Copper |
| title_full | Exploring Surface-Driven Mechanisms for Low-Temperature Sintering of Nanoscale Copper |
| title_fullStr | Exploring Surface-Driven Mechanisms for Low-Temperature Sintering of Nanoscale Copper |
| title_full_unstemmed | Exploring Surface-Driven Mechanisms for Low-Temperature Sintering of Nanoscale Copper |
| title_short | Exploring Surface-Driven Mechanisms for Low-Temperature Sintering of Nanoscale Copper |
| title_sort | exploring surface driven mechanisms for low temperature sintering of nanoscale copper |
| topic | low-temperature sintering nanoparticle surface atomic motion molecular dynamic simulation |
| url | https://www.mdpi.com/2076-3417/15/1/476 |
| work_keys_str_mv | AT jingyanli exploringsurfacedrivenmechanismsforlowtemperaturesinteringofnanoscalecopper AT zixiansong exploringsurfacedrivenmechanismsforlowtemperaturesinteringofnanoscalecopper AT zhichaoliu exploringsurfacedrivenmechanismsforlowtemperaturesinteringofnanoscalecopper AT xianlixie exploringsurfacedrivenmechanismsforlowtemperaturesinteringofnanoscalecopper AT penghuiguan exploringsurfacedrivenmechanismsforlowtemperaturesinteringofnanoscalecopper AT yiyingzhu exploringsurfacedrivenmechanismsforlowtemperaturesinteringofnanoscalecopper |