EFFECT OF DIE ADHESIVE ON THE PERFORMANCE OF HIGH-G MEMS ACCELEROMETER
The sensitivity and reliability of packaged high-g MEMS accelerometer strongly depends on die attach quality that should pay special attention in the operation. A package method based on die attach is presented for a prepared MEMS high-g accelerometers by using two die attach adhesives with differen...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | zho |
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Editorial Office of Journal of Mechanical Strength
2018-01-01
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| Series: | Jixie qiangdu |
| Subjects: | |
| Online Access: | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2018.01.015 |
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| _version_ | 1841535402194763776 |
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| author | GUO HuiYu WEN Feng KANG Qiang SHI YunBo WANG YanYang |
| author_facet | GUO HuiYu WEN Feng KANG Qiang SHI YunBo WANG YanYang |
| author_sort | GUO HuiYu |
| collection | DOAJ |
| description | The sensitivity and reliability of packaged high-g MEMS accelerometer strongly depends on die attach quality that should pay special attention in the operation. A package method based on die attach is presented for a prepared MEMS high-g accelerometers by using two die attach adhesives with different elasticity modulus. The effect of the die adhesive on the performances has been studied by using finite element analysis（ FEA） and Hopkinson pressure bar measurement system simultaneously. With the consistent package process,we have experimentally demonstrated that the characteristic of dynamic sensitivity for the prepared MEMS high-g accelerometers increases with the increasing of elasticity modulus of the die attach adhesives. From this result,it is possible to fabricate MEMS high-g accelerometer with bigger sensitivity by applying die attach adhesive with bigger elasticity modulus. |
| format | Article |
| id | doaj-art-e65150dc94804deb8f477a77830d255b |
| institution | Kabale University |
| issn | 1001-9669 |
| language | zho |
| publishDate | 2018-01-01 |
| publisher | Editorial Office of Journal of Mechanical Strength |
| record_format | Article |
| series | Jixie qiangdu |
| spelling | doaj-art-e65150dc94804deb8f477a77830d255b2025-01-15T02:32:46ZzhoEditorial Office of Journal of Mechanical StrengthJixie qiangdu1001-96692018-01-0140838730600687EFFECT OF DIE ADHESIVE ON THE PERFORMANCE OF HIGH-G MEMS ACCELEROMETERGUO HuiYuWEN FengKANG QiangSHI YunBoWANG YanYangThe sensitivity and reliability of packaged high-g MEMS accelerometer strongly depends on die attach quality that should pay special attention in the operation. A package method based on die attach is presented for a prepared MEMS high-g accelerometers by using two die attach adhesives with different elasticity modulus. The effect of the die adhesive on the performances has been studied by using finite element analysis（ FEA） and Hopkinson pressure bar measurement system simultaneously. With the consistent package process,we have experimentally demonstrated that the characteristic of dynamic sensitivity for the prepared MEMS high-g accelerometers increases with the increasing of elasticity modulus of the die attach adhesives. From this result,it is possible to fabricate MEMS high-g accelerometer with bigger sensitivity by applying die attach adhesive with bigger elasticity modulus.http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2018.01.015PackagingDie processHigh-g MEMS accelerometerElastic modulusFinite element analysis（FEA）Hopkinson Bar |
| spellingShingle | GUO HuiYu WEN Feng KANG Qiang SHI YunBo WANG YanYang EFFECT OF DIE ADHESIVE ON THE PERFORMANCE OF HIGH-G MEMS ACCELEROMETER Jixie qiangdu Packaging Die process High-g MEMS accelerometer Elastic modulus Finite element analysis（FEA） Hopkinson Bar |
| title | EFFECT OF DIE ADHESIVE ON THE PERFORMANCE OF HIGH-G MEMS ACCELEROMETER |
| title_full | EFFECT OF DIE ADHESIVE ON THE PERFORMANCE OF HIGH-G MEMS ACCELEROMETER |
| title_fullStr | EFFECT OF DIE ADHESIVE ON THE PERFORMANCE OF HIGH-G MEMS ACCELEROMETER |
| title_full_unstemmed | EFFECT OF DIE ADHESIVE ON THE PERFORMANCE OF HIGH-G MEMS ACCELEROMETER |
| title_short | EFFECT OF DIE ADHESIVE ON THE PERFORMANCE OF HIGH-G MEMS ACCELEROMETER |
| title_sort | effect of die adhesive on the performance of high g mems accelerometer |
| topic | Packaging Die process High-g MEMS accelerometer Elastic modulus Finite element analysis（FEA） Hopkinson Bar |
| url | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2018.01.015 |
| work_keys_str_mv | AT guohuiyu effectofdieadhesiveontheperformanceofhighgmemsaccelerometer AT wenfeng effectofdieadhesiveontheperformanceofhighgmemsaccelerometer AT kangqiang effectofdieadhesiveontheperformanceofhighgmemsaccelerometer AT shiyunbo effectofdieadhesiveontheperformanceofhighgmemsaccelerometer AT wangyanyang effectofdieadhesiveontheperformanceofhighgmemsaccelerometer |