QiangYi, C., ZhiHu, L., Feng, T., FengHua, Z., Gang, Z., & Bo, W. RESEARCH ON THERMAL FATIGUE LIFE OF SOLDER JOINTS FOR AIRBORNE ELECTRONIC EQUIPMENT. Editorial Office of Journal of Mechanical Strength.
Chicago Style (17th ed.) CitationQiangYi, CU, LIU ZhiHu, TIAN Feng, ZHANG FengHua, ZHAO Gang, and WU Bo. RESEARCH ON THERMAL FATIGUE LIFE OF SOLDER JOINTS FOR AIRBORNE ELECTRONIC EQUIPMENT. Editorial Office of Journal of Mechanical Strength.
MLA (9th ed.) CitationQiangYi, CU, et al. RESEARCH ON THERMAL FATIGUE LIFE OF SOLDER JOINTS FOR AIRBORNE ELECTRONIC EQUIPMENT. Editorial Office of Journal of Mechanical Strength.
Warning: These citations may not always be 100% accurate.