RESEARCH PROGRESS ON CUTTING TECHNOLOGY OF SIC MONO-CRYSTAL WAFER WITH WIRE SAW
Having a unique physical characteristics and stable semiconductor properties,silicon carbide（ Si C） monocrystal wafer has been widely used in integrated circuits,space optics and other fields.In manufacturing process of Si C monocrystal wafer,cutting is primary key process,which the cutting costs ac...
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| Format: | Article |
| Language: | zho |
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Editorial Office of Journal of Mechanical Strength
2015-01-01
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| Series: | Jixie qiangdu |
| Subjects: | |
| Online Access: | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2015.05.004 |
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| author | LI Lun LI ShuJuan TANG AoFei LI Yan |
| author_facet | LI Lun LI ShuJuan TANG AoFei LI Yan |
| author_sort | LI Lun |
| collection | DOAJ |
| description | Having a unique physical characteristics and stable semiconductor properties,silicon carbide（ Si C） monocrystal wafer has been widely used in integrated circuits,space optics and other fields.In manufacturing process of Si C monocrystal wafer,cutting is primary key process,which the cutting costs accounts for more than 50% of the whole wafer processing costs.In this paper,the datum and relevant literature of domestic and foreign were reviewed to,the current research status of Si C cutting technology,especially cutting with wire saw,and cutting equipment were studied.Moreover,the existing problems in Si C cut by wire saw and in cutting equipment was analyzed.It is proposed that the future researching direction of Si C wafer cutting technology by wire saw. |
| format | Article |
| id | doaj-art-df93474d4df94734ab03186b79c7ebb2 |
| institution | Kabale University |
| issn | 1001-9669 |
| language | zho |
| publishDate | 2015-01-01 |
| publisher | Editorial Office of Journal of Mechanical Strength |
| record_format | Article |
| series | Jixie qiangdu |
| spelling | doaj-art-df93474d4df94734ab03186b79c7ebb22025-01-15T02:37:56ZzhoEditorial Office of Journal of Mechanical StrengthJixie qiangdu1001-96692015-01-013784985630592902RESEARCH PROGRESS ON CUTTING TECHNOLOGY OF SIC MONO-CRYSTAL WAFER WITH WIRE SAWLI LunLI ShuJuanTANG AoFeiLI YanHaving a unique physical characteristics and stable semiconductor properties,silicon carbide（ Si C） monocrystal wafer has been widely used in integrated circuits,space optics and other fields.In manufacturing process of Si C monocrystal wafer,cutting is primary key process,which the cutting costs accounts for more than 50% of the whole wafer processing costs.In this paper,the datum and relevant literature of domestic and foreign were reviewed to,the current research status of Si C cutting technology,especially cutting with wire saw,and cutting equipment were studied.Moreover,the existing problems in Si C cut by wire saw and in cutting equipment was analyzed.It is proposed that the future researching direction of Si C wafer cutting technology by wire saw.http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2015.05.004SiC mono-crystal waferDiamond wire sawCutting technology with wire sawPresent researching status |
| spellingShingle | LI Lun LI ShuJuan TANG AoFei LI Yan RESEARCH PROGRESS ON CUTTING TECHNOLOGY OF SIC MONO-CRYSTAL WAFER WITH WIRE SAW Jixie qiangdu SiC mono-crystal wafer Diamond wire saw Cutting technology with wire saw Present researching status |
| title | RESEARCH PROGRESS ON CUTTING TECHNOLOGY OF SIC MONO-CRYSTAL WAFER WITH WIRE SAW |
| title_full | RESEARCH PROGRESS ON CUTTING TECHNOLOGY OF SIC MONO-CRYSTAL WAFER WITH WIRE SAW |
| title_fullStr | RESEARCH PROGRESS ON CUTTING TECHNOLOGY OF SIC MONO-CRYSTAL WAFER WITH WIRE SAW |
| title_full_unstemmed | RESEARCH PROGRESS ON CUTTING TECHNOLOGY OF SIC MONO-CRYSTAL WAFER WITH WIRE SAW |
| title_short | RESEARCH PROGRESS ON CUTTING TECHNOLOGY OF SIC MONO-CRYSTAL WAFER WITH WIRE SAW |
| title_sort | research progress on cutting technology of sic mono crystal wafer with wire saw |
| topic | SiC mono-crystal wafer Diamond wire saw Cutting technology with wire saw Present researching status |
| url | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2015.05.004 |
| work_keys_str_mv | AT lilun researchprogressoncuttingtechnologyofsicmonocrystalwaferwithwiresaw AT lishujuan researchprogressoncuttingtechnologyofsicmonocrystalwaferwithwiresaw AT tangaofei researchprogressoncuttingtechnologyofsicmonocrystalwaferwithwiresaw AT liyan researchprogressoncuttingtechnologyofsicmonocrystalwaferwithwiresaw |