Nonlinear Elastoplastic Response and Damage Modeling in Power Electronics Packages Under Thermal Cycling
One of the common reliability tests performed on power modules for automotive applications is passive thermal cycling, which is conventionally representative of the highly demanding thermomechanical loads typical of steady-state operating conditions. The mechanical response of the electronics device...
Saved in:
| Main Authors: | Giuseppe Mirone, Raffaele Barbagallo, Luca Corallo, Giuseppe Bua, Guido La Rosa, Giovanna Fargione, Fabio Giudice |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-04-01
|
| Series: | Engineering Proceedings |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2673-4591/85/1/50 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Influence of Geometric Non-Linearities on the Mixed-Mode Decomposition in Asymmetric DCB Samples
by: Jorge Bonhomme, et al.
Published: (2025-05-01) -
Round and pleated blisters: interface delamination in thin film deposition
by: Wenxiang Wang, et al.
Published: (2025-04-01) -
Interfacial delamination on fan-out wafer-level package using finite element analysis
by: Ariel P. Conversion, et al.
Published: (2025-06-01) -
Delamination-Driven Nonlinear Buckling of Metal–Composite Cylindrical Shells with Different Interfacial Strengths
by: Chenyang Di, et al.
Published: (2025-06-01) -
Sustainable Packaging Design: Packaging Optimization and Material Reduction for Environmental Protection and Economic Benefits to Industry and Society
by: Elias D. Georgakoudis, et al.
Published: (2025-07-01)