STUDY ON RELIABILITY OF PHOTOELECTRIC PCB UNDER THERMAL CYCLE

STUDY ON RELIABILITY OF PHOTOELECTRIC PCB UNDER THERMAL CYCLE

The influence of thermal cycle loading on optoelectronic PCB（Printed Circuit Board） reliability was presented.In product conceptual design stage,the three-dimensional finite element model of photoelectric PCB was established.The finite element analysis was carried out under thermal cycle loading whi...

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Bibliographic Details
Main Authors: CHENG Lei, ZHOU DeJian, WU ZhaoHua
Format: Article
Language:zho
Published: Editorial Office of Journal of Mechanical Strength 2017-01-01
Series:Jixie qiangdu
Subjects:
Photoelectric PCB
Thermal cycle
Finite element analysis
Reliability
Online Access:http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2017.04.028
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