STUDY ON RELIABILITY OF PHOTOELECTRIC PCB UNDER THERMAL CYCLE
The influence of thermal cycle loading on optoelectronic PCB（Printed Circuit Board） reliability was presented.In product conceptual design stage,the three-dimensional finite element model of photoelectric PCB was established.The finite element analysis was carried out under thermal cycle loading whi...
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| Format: | Article |
| Language: | zho |
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Editorial Office of Journal of Mechanical Strength
2017-01-01
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| Series: | Jixie qiangdu |
| Subjects: | |
| Online Access: | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2017.04.028 |
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| author | CHENG Lei ZHOU DeJian WU ZhaoHua |
| author_facet | CHENG Lei ZHOU DeJian WU ZhaoHua |
| author_sort | CHENG Lei |
| collection | DOAJ |
| description | The influence of thermal cycle loading on optoelectronic PCB（Printed Circuit Board） reliability was presented.In product conceptual design stage,the three-dimensional finite element model of photoelectric PCB was established.The finite element analysis was carried out under thermal cycle loading which defined by GJB 150.5-86.The influence includes solder joints reliability of optoelectronic PCB,optical coupling efficiency and optical fiber reliability.The following results are obtained.First,the maximum stress of solder joint and optical fiber ribbon is in the security range and the structure is not destroyed.Second,photoelectric coupling efficiency is not changed significantly,which guarantees the stability of the optical transmission.It proves the feasibility of the design scheme and promotes the engineering applications of photoelectric interconnection technology. |
| format | Article |
| id | doaj-art-d13a2632b6164542b44ee8a3d16779df |
| institution | Kabale University |
| issn | 1001-9669 |
| language | zho |
| publishDate | 2017-01-01 |
| publisher | Editorial Office of Journal of Mechanical Strength |
| record_format | Article |
| series | Jixie qiangdu |
| spelling | doaj-art-d13a2632b6164542b44ee8a3d16779df2025-01-15T02:34:04ZzhoEditorial Office of Journal of Mechanical StrengthJixie qiangdu1001-96692017-01-013990490830599249STUDY ON RELIABILITY OF PHOTOELECTRIC PCB UNDER THERMAL CYCLECHENG LeiZHOU DeJianWU ZhaoHuaThe influence of thermal cycle loading on optoelectronic PCB（Printed Circuit Board） reliability was presented.In product conceptual design stage,the three-dimensional finite element model of photoelectric PCB was established.The finite element analysis was carried out under thermal cycle loading which defined by GJB 150.5-86.The influence includes solder joints reliability of optoelectronic PCB,optical coupling efficiency and optical fiber reliability.The following results are obtained.First,the maximum stress of solder joint and optical fiber ribbon is in the security range and the structure is not destroyed.Second,photoelectric coupling efficiency is not changed significantly,which guarantees the stability of the optical transmission.It proves the feasibility of the design scheme and promotes the engineering applications of photoelectric interconnection technology.http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2017.04.028Photoelectric PCBThermal cycleFinite element analysisReliability |
| spellingShingle | CHENG Lei ZHOU DeJian WU ZhaoHua STUDY ON RELIABILITY OF PHOTOELECTRIC PCB UNDER THERMAL CYCLE Jixie qiangdu Photoelectric PCB Thermal cycle Finite element analysis Reliability |
| title | STUDY ON RELIABILITY OF PHOTOELECTRIC PCB UNDER THERMAL CYCLE |
| title_full | STUDY ON RELIABILITY OF PHOTOELECTRIC PCB UNDER THERMAL CYCLE |
| title_fullStr | STUDY ON RELIABILITY OF PHOTOELECTRIC PCB UNDER THERMAL CYCLE |
| title_full_unstemmed | STUDY ON RELIABILITY OF PHOTOELECTRIC PCB UNDER THERMAL CYCLE |
| title_short | STUDY ON RELIABILITY OF PHOTOELECTRIC PCB UNDER THERMAL CYCLE |
| title_sort | study on reliability of photoelectric pcb under thermal cycle |
| topic | Photoelectric PCB Thermal cycle Finite element analysis Reliability |
| url | http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2017.04.028 |
| work_keys_str_mv | AT chenglei studyonreliabilityofphotoelectricpcbunderthermalcycle AT zhoudejian studyonreliabilityofphotoelectricpcbunderthermalcycle AT wuzhaohua studyonreliabilityofphotoelectricpcbunderthermalcycle |