APA (7th ed.) Citation

Lei, C., DeJian, Z., & ZhaoHua, W. STUDY ON RELIABILITY OF PHOTOELECTRIC PCB UNDER THERMAL CYCLE. Editorial Office of Journal of Mechanical Strength.

Chicago Style (17th ed.) Citation

Lei, CHENG, ZHOU DeJian, and WU ZhaoHua. STUDY ON RELIABILITY OF PHOTOELECTRIC PCB UNDER THERMAL CYCLE. Editorial Office of Journal of Mechanical Strength.

MLA (9th ed.) Citation

Lei, CHENG, et al. STUDY ON RELIABILITY OF PHOTOELECTRIC PCB UNDER THERMAL CYCLE. Editorial Office of Journal of Mechanical Strength.

Warning: These citations may not always be 100% accurate.