Effects of Hf addition on the microstructure and properties of Cu-Sn-P alloy
In this paper, the effects of Hf addition on the mechanical properties, electrical conductivity and microstructure of Cu-Sn-P alloy were investigated. The results show that the Hf addition can enhance the mechanical properties and electrical conductivity of Cu-Sn-P alloy. The alloy with 0.05 wt% Hf...
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Main Authors: | Biao Wei, Haoren Yang, Chen Wang, Jianhui Zhou, Lei Xiao, Tianyu Ma, Bingshu Wang |
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Format: | Article |
Language: | English |
Published: |
Elsevier
2024-11-01
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Series: | Journal of Materials Research and Technology |
Subjects: | |
Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424023032 |
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