AI-Based Prediction of Warpage in Organic Substrates
In substrate fabrication, thermal mismatch between materials and structural configurations can readily induce warpage deformation, which severely impacts subsequent chip mounting and solder joint alignment processes, ultimately compromising the reliability of packaging integration. Therefore, invest...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2025-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/11108242/ |
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