Effect of Ni/Sn ratio on microstructure and properties of Cu-Ni-Sn-P alloy
Abstract Cu-1.33Ni-1.35Sn-0.08P(Ni/Sn = 1/1), Cu-0.87Ni-1.82Sn-0.08P (Ni/Sn = 1/2) and Cu-1.78Ni-0.86Sn-0.08P (Ni/Sn = 2/1) alloys were prepared to explore the effect of different Ni/Sn ratios on the microstructure and properties of the alloys. The results showed that the alloy had the best properti...
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Nature Portfolio
2024-12-01
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| Online Access: | https://doi.org/10.1038/s41598-024-80079-w |
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| author | Xiaokang Chen Xiangpeng Xiao Dawei Yuan Jinshui Chen Yu Wu |
| author_facet | Xiaokang Chen Xiangpeng Xiao Dawei Yuan Jinshui Chen Yu Wu |
| author_sort | Xiaokang Chen |
| collection | DOAJ |
| description | Abstract Cu-1.33Ni-1.35Sn-0.08P(Ni/Sn = 1/1), Cu-0.87Ni-1.82Sn-0.08P (Ni/Sn = 1/2) and Cu-1.78Ni-0.86Sn-0.08P (Ni/Sn = 2/1) alloys were prepared to explore the effect of different Ni/Sn ratios on the microstructure and properties of the alloys. The results showed that the alloy had the best properties when Ni/Sn = 1/2. At peak aging, its tensile strength and conductivity reached 447.3 MPa and 35.5% IACS respectively. Its tensile strength was 65.1 MPa and 88.8 MPa higher than that of the alloys with Ni/Sn = 1/1 and Ni/Sn = 2/1 respectively, and its conductivity was 1.1% IACS and 3.9% IACS higher. All three alloys had obvious dendrite segregation, but the alloy with Ni/Sn = 1/2 had finer dendrites and a more uniform distribution. In addition, the precipitates in the Cu-Ni-Sn-P alloys with Ni/Sn = 1/2 and Ni/Sn = 1/1 were all granular Ni12P5 phases, and the particles of the former are finer. The precipitates in the Cu-Ni-Sn-P alloy with Ni/Sn = 2/1 were rod-shaped. The strengthening mechanisms of the three alloys were Orowan strengthening, grain boundary strengthening, solid solution strengthening and dislocation strengthening, and Orowan strengthening was dominant. The Cu-Ni-Sn-P alloy with Ni/Sn = 1/2 had finer grains and precipitates, resulting in better tensile strength and electrical conductivity. |
| format | Article |
| id | doaj-art-caac04afaa614adbb917a3bfb9fada8d |
| institution | Kabale University |
| issn | 2045-2322 |
| language | English |
| publishDate | 2024-12-01 |
| publisher | Nature Portfolio |
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| series | Scientific Reports |
| spelling | doaj-art-caac04afaa614adbb917a3bfb9fada8d2025-01-05T12:28:55ZengNature PortfolioScientific Reports2045-23222024-12-0114111110.1038/s41598-024-80079-wEffect of Ni/Sn ratio on microstructure and properties of Cu-Ni-Sn-P alloyXiaokang Chen0Xiangpeng Xiao1Dawei Yuan2Jinshui Chen3Yu Wu4Jiangxi Advanced Copper Industry Research Institute, JiangXi University of Science and TechnologyJiangxi Advanced Copper Industry Research Institute, JiangXi University of Science and TechnologyJiangxi Advanced Copper Industry Research Institute, JiangXi University of Science and TechnologySchool of Materials Science and Engineering, JiangXi University of Science and TechnologyInstitute of Applied Physics, Jiangxi Academy of SciencesAbstract Cu-1.33Ni-1.35Sn-0.08P(Ni/Sn = 1/1), Cu-0.87Ni-1.82Sn-0.08P (Ni/Sn = 1/2) and Cu-1.78Ni-0.86Sn-0.08P (Ni/Sn = 2/1) alloys were prepared to explore the effect of different Ni/Sn ratios on the microstructure and properties of the alloys. The results showed that the alloy had the best properties when Ni/Sn = 1/2. At peak aging, its tensile strength and conductivity reached 447.3 MPa and 35.5% IACS respectively. Its tensile strength was 65.1 MPa and 88.8 MPa higher than that of the alloys with Ni/Sn = 1/1 and Ni/Sn = 2/1 respectively, and its conductivity was 1.1% IACS and 3.9% IACS higher. All three alloys had obvious dendrite segregation, but the alloy with Ni/Sn = 1/2 had finer dendrites and a more uniform distribution. In addition, the precipitates in the Cu-Ni-Sn-P alloys with Ni/Sn = 1/2 and Ni/Sn = 1/1 were all granular Ni12P5 phases, and the particles of the former are finer. The precipitates in the Cu-Ni-Sn-P alloy with Ni/Sn = 2/1 were rod-shaped. The strengthening mechanisms of the three alloys were Orowan strengthening, grain boundary strengthening, solid solution strengthening and dislocation strengthening, and Orowan strengthening was dominant. The Cu-Ni-Sn-P alloy with Ni/Sn = 1/2 had finer grains and precipitates, resulting in better tensile strength and electrical conductivity.https://doi.org/10.1038/s41598-024-80079-wCu-Ni-Sn-P alloyTensile strengthDendrite segregationNi12P5 phasesOrowan strengthening |
| spellingShingle | Xiaokang Chen Xiangpeng Xiao Dawei Yuan Jinshui Chen Yu Wu Effect of Ni/Sn ratio on microstructure and properties of Cu-Ni-Sn-P alloy Scientific Reports Cu-Ni-Sn-P alloy Tensile strength Dendrite segregation Ni12P5 phases Orowan strengthening |
| title | Effect of Ni/Sn ratio on microstructure and properties of Cu-Ni-Sn-P alloy |
| title_full | Effect of Ni/Sn ratio on microstructure and properties of Cu-Ni-Sn-P alloy |
| title_fullStr | Effect of Ni/Sn ratio on microstructure and properties of Cu-Ni-Sn-P alloy |
| title_full_unstemmed | Effect of Ni/Sn ratio on microstructure and properties of Cu-Ni-Sn-P alloy |
| title_short | Effect of Ni/Sn ratio on microstructure and properties of Cu-Ni-Sn-P alloy |
| title_sort | effect of ni sn ratio on microstructure and properties of cu ni sn p alloy |
| topic | Cu-Ni-Sn-P alloy Tensile strength Dendrite segregation Ni12P5 phases Orowan strengthening |
| url | https://doi.org/10.1038/s41598-024-80079-w |
| work_keys_str_mv | AT xiaokangchen effectofnisnratioonmicrostructureandpropertiesofcunisnpalloy AT xiangpengxiao effectofnisnratioonmicrostructureandpropertiesofcunisnpalloy AT daweiyuan effectofnisnratioonmicrostructureandpropertiesofcunisnpalloy AT jinshuichen effectofnisnratioonmicrostructureandpropertiesofcunisnpalloy AT yuwu effectofnisnratioonmicrostructureandpropertiesofcunisnpalloy |