A high-efficiency transformer-in-package isolated DC-DC converter using glass-based fan-out wafer-level packaging
A transformer-in-package (TiP) isolated direct current–direct current (DC-DC) converter using glass-based fan-out wafer-level packaging (FOWLP) is proposed. By using 3-layer redistribution layers (RDLs), both the transformer and interconnections are built without an additional transformer chip, and...
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| Format: | Article |
| Language: | English |
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KeAi Communications Co. Ltd.
2024-11-01
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| Series: | Fundamental Research |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2667325823001322 |
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| author | Lin Cheng Zuohuan Chen Daquan Yu Dongfang Pan |
| author_facet | Lin Cheng Zuohuan Chen Daquan Yu Dongfang Pan |
| author_sort | Lin Cheng |
| collection | DOAJ |
| description | A transformer-in-package (TiP) isolated direct current–direct current (DC-DC) converter using glass-based fan-out wafer-level packaging (FOWLP) is proposed. By using 3-layer redistribution layers (RDLs), both the transformer and interconnections are built without an additional transformer chip, and the converter only has 2 dies: a transmitter (TX) chip and a receiver (RX) chip. The proposed solution results in a significant reduction in the cost and makes major improvements in the form factor and power density. Moreover, the transformer built by the RDLs achieves a high quality factor (Q) and high coupling factor (k), and the efficiency of the converter is thus improved. The TX and RX chips were implemented in a 0.18 µm Biopolar CMOS DMOS (BCD) process and embedded in a compact package with a size of 5 mm × 5 mm. With an output capacitance of 10 µF, the converter achieves a peak efficiency of 46.5% at 0.3 W output power and a maximum delivery power of 1.25 W, achieving a maximum power density of 50 mW/mm2. |
| format | Article |
| id | doaj-art-c7c858c936e24a8e954957e1280a726b |
| institution | Kabale University |
| issn | 2667-3258 |
| language | English |
| publishDate | 2024-11-01 |
| publisher | KeAi Communications Co. Ltd. |
| record_format | Article |
| series | Fundamental Research |
| spelling | doaj-art-c7c858c936e24a8e954957e1280a726b2024-12-01T05:08:50ZengKeAi Communications Co. Ltd.Fundamental Research2667-32582024-11-014614071414A high-efficiency transformer-in-package isolated DC-DC converter using glass-based fan-out wafer-level packagingLin Cheng0Zuohuan Chen1Daquan Yu2Dongfang Pan3School of Microelectronics, University of Science and Technology of China, Hefei 230026, ChinaSchool of Electronic Science and Engineering, Xiamen University, Xiamen 361005, ChinaSchool of Electronic Science and Engineering, Xiamen University, Xiamen 361005, ChinaSchool of Microelectronics, University of Science and Technology of China, Hefei 230026, China; Corresponding author.A transformer-in-package (TiP) isolated direct current–direct current (DC-DC) converter using glass-based fan-out wafer-level packaging (FOWLP) is proposed. By using 3-layer redistribution layers (RDLs), both the transformer and interconnections are built without an additional transformer chip, and the converter only has 2 dies: a transmitter (TX) chip and a receiver (RX) chip. The proposed solution results in a significant reduction in the cost and makes major improvements in the form factor and power density. Moreover, the transformer built by the RDLs achieves a high quality factor (Q) and high coupling factor (k), and the efficiency of the converter is thus improved. The TX and RX chips were implemented in a 0.18 µm Biopolar CMOS DMOS (BCD) process and embedded in a compact package with a size of 5 mm × 5 mm. With an output capacitance of 10 µF, the converter achieves a peak efficiency of 46.5% at 0.3 W output power and a maximum delivery power of 1.25 W, achieving a maximum power density of 50 mW/mm2.http://www.sciencedirect.com/science/article/pii/S2667325823001322Isolated DC-DC converterTransmitter (TX)Receiver (RX)TransformerFan-out wafer level packaging (FOWLP)Power density |
| spellingShingle | Lin Cheng Zuohuan Chen Daquan Yu Dongfang Pan A high-efficiency transformer-in-package isolated DC-DC converter using glass-based fan-out wafer-level packaging Fundamental Research Isolated DC-DC converter Transmitter (TX) Receiver (RX) Transformer Fan-out wafer level packaging (FOWLP) Power density |
| title | A high-efficiency transformer-in-package isolated DC-DC converter using glass-based fan-out wafer-level packaging |
| title_full | A high-efficiency transformer-in-package isolated DC-DC converter using glass-based fan-out wafer-level packaging |
| title_fullStr | A high-efficiency transformer-in-package isolated DC-DC converter using glass-based fan-out wafer-level packaging |
| title_full_unstemmed | A high-efficiency transformer-in-package isolated DC-DC converter using glass-based fan-out wafer-level packaging |
| title_short | A high-efficiency transformer-in-package isolated DC-DC converter using glass-based fan-out wafer-level packaging |
| title_sort | high efficiency transformer in package isolated dc dc converter using glass based fan out wafer level packaging |
| topic | Isolated DC-DC converter Transmitter (TX) Receiver (RX) Transformer Fan-out wafer level packaging (FOWLP) Power density |
| url | http://www.sciencedirect.com/science/article/pii/S2667325823001322 |
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