A novel SS/Cu composite with bioinspired helical-lamellar-interpenetrated structure by direct ink writing and pressureless infiltration
Inspired by the outstanding performance of natural materials due to their distinctive structures, we utilized direct ink writing (DIW) and pressureless infiltration techniques to design and manufacture innovative SS/Cu composites featuring helical lamellar interpenetrated structures (HLIs). DIW was...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-01-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424030722 |
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