Reliability of Substrate Solder Joints from Power Cycling Tests
The lifetime of the solder joint between base plate and ceramic substrate is usually tested by passively heating and cooling the IGBT module (thermal cycling). This provokes failures (delamination) in that solder layer. However, the IGBT and diode dies are actively heated in the application. Other f...
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| Main Authors: | , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Control and Information Technology
2010-01-01
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| Series: | Kongzhi Yu Xinxi Jishu |
| Subjects: | |
| Online Access: | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2010.04.011 |
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