Pushing Heterojunction Technology Further: Novel Metallization Processes and Architectures
This work provides an overview on the different approaches to make Silicon Hetero-Junction cell (SHJ) production more scalable by investigating alternative metallization processes which can potentially be competitive with the standard Ag-based processes (Ag micro-size). With this purpose, this rese...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
TIB Open Publishing
2025-01-01
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| Series: | SiliconPV Conference Proceedings |
| Subjects: | |
| Online Access: | https://www.tib-op.org/ojs/index.php/siliconpv/article/view/1305 |
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| Summary: | This work provides an overview on the different approaches to make Silicon Hetero-Junction cell (SHJ) production more scalable by investigating alternative metallization processes which can potentially be competitive with the standard Ag-based processes (Ag micro-size). With this purpose, this research aims at introducing the idea of widely using Ag-coated Cu formulations and/or low-Ag deposit solutions involving Ag nanoparticles-based formulations and reactive Ag (also referred as particle free) inks for both rear and front cell depositions on a single (finger and busbars) screen-printing process.
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| ISSN: | 2940-2123 |