Study on hot deformation behavior and microstructure evolution of ultrafine W-0.5 wt%La2O3 alloy wire during processing
Tungsten wire with high strength and toughness for silicon wafer cutting in photovoltaic industry is a new hot research content. In order to improve the strength and processing performance of tungsten wire, tungsten alloy containing 0.5 wt%La2O3 was prepared by powder metallurgy method. The hot defo...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-01-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424028989 |
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